Industry News | 2009-07-28 12:23:26.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
Industry News | 2009-07-30 21:06:08.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
Industry News | 2021-11-03 13:23:54.0
After two years of predominantly digital meetings, the trade fair organizer Mesago Messe Frankfurt is looking forward to holding the SMTconnect on-site in Nuremberg, Germany, once again. Europe's leading event on solutions for electronic assemblies and systems will take place from 10 – 12 May 2022.
Industry News | 2007-05-01 17:10:22.0
Bosch Rexroth has launched a new website to help automotive companies and their suppliers improve productivity, reliability and efficiency in all areas of manufacturing. The site is located at www.boschrexroth-us.com/automotive.
Industry News | 2009-08-06 14:14:33.0
Rosenheim, Germany — August 2009 — Multitest, a designer and manufacturer of final test handlers and final test sockets used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that the Multitest business unit “ECT Interface Products” received the “Plaque of Appreciation” from Cypress.
Industry News | 2010-06-23 13:36:30.0
Multitest, a designer and manufacturer of final test handlers and final test sockets used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that Bernhard Lorenz, Director of Engineering, will present a paper titled “Test in Carriers - The New Test Solution” at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.
Industry News | 2010-06-28 14:27:53.0
Multitest, a designer and manufacturer of final test handlers and final test sockets used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that Günther Jeserer, Business Unit Manager, will hold a Docking and Mounting Interface Workgroup meeting at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.
Industry News | 2009-08-04 14:19:11.0
Rosenheim, Germany — August 2009 — Multitest, a designer and manufacturer of final test handlers and final test sockets used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, introduces the new Automatic Contactor Cleaning (ACC) feature for the MT9510, capable of cleaning the contactor fast and without manual interruption of the handling process.
Industry News | 2009-08-07 14:40:07.0
Rosenheim, Germany — August 2009 — Multitest, a designer and manufacturer of final test handlers and final test sockets used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, is pleased to announce that Steve Dielman is the new Regional Manager for Multitest’s US handler business.
Industry News | 2008-08-01 00:29:58.0
With the well-respected die attach brands of Hysol� and Ablestik�, Henkel has long been recognized for consistently pushing the bar higher when it comes to advanced semiconductor materials development. This pioneering philosophy has led to the development of yet another groundbreaking materials advance and the launch of Henkel's Ablestik 8000� Wafer Backside Coating� (WBC) technology.
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