New Equipment | Education/Training
BEST IPC J-STD-001 Revision F training kits feature REAL circuit boards that represent actual soldering conditions. This kit features "062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This
High speed, precision dispensing by digital and cam drives. High speed, precision dispensing: 0.08 sec./dot saves floor space due to compact design. Glue is charged with compressed air at a high speed and the advanced cam-link head mechanism is abl
Electronics Forum | Fri Sep 19 10:35:56 EDT 2008 | mi
No, I don't have Panapro at all. Some Mydata files I've exported end in: *.cmp & *.gen Files saved on floppy from Panasonic MSH II end in: *.MNG, *.POS, *.SET Panasonic program filenames come out as: CF000000.POS CF000001.POS ... Sample quote of
Electronics Forum | Fri Apr 11 05:51:20 EDT 2008 | janz
w/4t=0.8 Regards Jan
Used SMT Equipment | Chipshooters / Chip Mounters
Yamaha used YG100 Chip Mounter Model YG100 Board size M-Type: L460xW330 ~ L50xW50mm/t = 0.4 ~ 3.0mm Mounting speed 0.15 seconds / accessories / 32mm QFP standard: 1.70 seconds / accessories 3) IPC9850 conditions: 17700CPH, Chip: 0.
Used SMT Equipment | General Purpose Equipment
Tyco Press MEP-12T Windows NT 12 Tons Light Curtains 30 x 36 PCB Size Contact for more information
Industry News | 2009-01-15 11:31:35.0
Smallest Ball Screws Commercially Available!
Industry News | 2020-09-27 05:00:36.0
Storagesolutions is pleased to announce that Robert J. Black Jr. (Bob) will host a free webinar entitled "SAVING MONEY with ESSEGI Automated Storage Systems." The webinar will be available in two separate sessions on Wednesday, Oct. 7, 2020 at 9 a.m. EDT (Session 1) and 1 p.m. EDT (Session 2).
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Parts & Supplies | Pick and Place/Feeders
Yamaha Feeder - SHIM T0.05 (KW1-M11BS-05) Pls kindly contact with us at any time, if you are insterest more info about products. Website : www.ksunsmt.com Email: jenny@ksunsmt.com Skype:jenny@ksunsmt.com MP: 0086-15629932323 What's app: 156299
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Parts & Supplies | Pick and Place/Feeders
Yamaha Feeder - SHIM T0.05 (KW1-M11BS-05) More SMT parts available H1067R A12GD25-1L-Z FUJI CP6 Solenoid valve H1068Z PCD2413-NB-D24 FUJI CP643 13 Solenoid valve H1082T RCS-242-M3-D24MP Solenoid valve H1084A SS23H-M5-D24-UPK Sensor H1124D FUJI
Technical Library | 2021-10-20 18:21:06.0
The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.
Technical Library | 2017-10-19 01:17:56.0
Wetting balance testing has been an industry standard for evaluating the solderability of surface finishes on printed circuit boards (PCB) for many years. A Wetting Balance Curve showing Force as a function of Time, along with the individual data outputs "Time to Zero" T(0), "Time to Two-Thirds Maximum Force" T(2/3), and "Maximum Force" F(max) are usually used to evaluate the solderability performance of various surface finishes. While a visual interpretation of the full curve is a quick way to compare various test results, this method is subjective and does not lend itself readily to a rigorous statistical evaluation. Therefore, very often, when a statistical evaluation is desired for comparing the solderability between different surface finishes or different test conditions, one of the individual parameters is chosen for convenience. However, focusing on a single output usually doesn't provide a complete picture of the solderability of the surface finish being evaluated.In this paper, various models here-in labeled as "point" and "area" models are generated using the three most commonly evaluated individual outputs T(0), T(2/3), and F(max). These models have been studied to quantify how well each describes the full wetting balance curve. The solderability score (S-Score) with ranking from 0 to 10 were given to quantify the wetting balance curve as the result of the model study, which corresponds well with experimental results.
BEST IPC J-STD-001 Revision F training kits feature REAL circuit boards that represent actual soldering conditions. This kit features "062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This
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