Industry News | 2020-09-17 12:26:40.0
Today, IPC issued a blog post in support of the FY 2021 National Defense Authorization Act (NDAA) provisions that would bolster the resiliency and security of the electronics manufacturing ecosystem, including printed circuit board (PCB) fabrication and printed circuit board assembly (PCBA), the green-and-gold hardwiring at the core of all electronics systems. These provisions, approved in both the U.S. House and Senate, aim to improve the security of electronics purchased by the Defense Department.
Industry News | 2020-10-04 15:08:41.0
IPC is known for developing addendums to some of its most widely used standards for specific industry sector use, including military/aerospace, space flight, automotive and telecommunications. Now, IPC has responded to requests from the medical device segment of the electronics industry and has released IPC-6012EM,Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2020-11-13 17:10:59.0
IMI, Inc. has successfully completed an intensive audit to IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements and has earned a Qualified Manufacturer's Listing (QML) under IPC's Validation Services program.
Industry News | 2020-11-19 14:20:11.0
IMI, Inc. has successfully completed an intensive audit to IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements and has earned a Qualified Manufacturer's Listing (QML) under IPC's Validation Services program.
Industry News | 2016-07-02 06:58:51.0
Scienscope International today announced that it has expanded its facility in Chino by adding an additional 6,000 ft2. The new space primarily will be used to expand the company’s demo room.
Fuji Pick and Place Machine Fuji NXTⅡ Pick and Place Machine H12S: 0402 ~ 7.5mm x 7.5mm H04: 6,000 cph 2MII Base:740 (L) x 1934 (W) Product description: Fuji Pick and Place Machine, H12S: 0402 ~ 7.5mm x 7.5mm, H04: 6,000 cph, 2MII Base:740 (L)
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Used SMT Equipment | Pick and Place/Feeders
Fuji NXT M6II SMT pick and place machine original used Model: NXT-M6II Placement speed: H12S:17,000 cph; H08:10,000 cph; H04:6,000 cph; H01:3,500 cph; F04:5,100 cph; OF:2,300 cph; GL:16,363 dph(0.22 sec/dot Patch range: H12S:0402~5.0mm x 5.0mm&n
Used SMT Equipment | Pick and Place/Feeders
Fuji NXT M6II SMT pick and place machine original used Model: NXT-M6II Placement speed: H12S:17,000 cph; H08:10,000 cph; H04:6,000 cph; H01:3,500 cph; F04:5,100 cph; OF:2,300 cph; GL:16,363 dph(0.22 sec/dot Patch range: H12S:0402~5.0mm x 5.0mm&n
Used SMT Equipment | Pick and Place/Feeders
Fuji NXT M6II SMT pick and place machine original used Model: NXT-M6II Placement speed: H12S:17,000 cph; H08:10,000 cph; H04:6,000 cph; H01:3,500 cph; F04:5,100 cph; OF:2,300 cph; GL:16,363 dph(0.22 sec/dot Patch range: H12S:0402~5.0mm x 5.0mm&n
