25 Sealants LOCTITE 5210 One-component ultra fast curing, non-corrosive RTV silicone designed for potting, wire tacking, selective sealing, vibration dampening and repair/rework applic
Industry News | 2015-04-21 16:57:06.0
The Balver Zinn Group announces that they will be attending SMT/Hybrid/Packaging 2015 scheduled to take place May 5-7 in Nuremberg, Germany. They will highlight the company’s latest solder flux and paste technology in Booth #7-308.
Industry News | 2012-07-26 09:54:31.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will sponsor and participate in the second annual IPC Midwest Soldering competition held in conjunction with the IPC Midwest Exhibition & Conference
Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
Industry News | 2010-01-19 13:47:38.0
January 2010 — The Balver Zinn Group announces that Cobar Europe BV will exhibit a complete range of advanced soldering materials from bar solder to SMT solder paste to high-performance fluxes at the upcoming Pan Pacific Microelectronics Symposium & Tabletop Exhibition, scheduled to take place January 26-28, 2010 at the Sheraton Kauai Resort, on Kauai, Hawaii.
Printed Circuit Board Protection Methods - Conformal Coating Encapsulants Potting Module Sealing Low Pressure Molding
Industry News | 2015-01-19 20:59:27.0
FCT Assembly today announced that it will present a new process for evaluating solder pastes in Booth #713 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Field application engineer, Tony Lentz, also will present the paper written on the new evaulation process titled “Dispelling the Black Magic of Solder Paste.” The presentation will be held during the Fluxes Technical Conference Session on Tuesday, Feb. 24 from 1:30-3 p.m.
New Equipment | Rework & Repair Equipment
This unique rework stenciling system is very simple to use. Adhesive Backed Stencil Thickness: 004in (.10mm), .005in (.13mm) and .006in (.15mm) Minimum Aperture Size: .002in (.05mm) Stencil Material: Plastic film with release liner. The adhesive bac
Industry News | 2009-09-18 09:44:06.0
September 2009 — The Balver Zinn Group announces that Cobar Solder Products will exhibit a complete range of advanced soldering materials ranging from bar solder to SMT solder paste to high-performance fluxes in booth 722 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2008-04-22 21:03:49.0
To offer added protection and stability for a wide range of electronics applications, Henkel has developed and made commercially available Loctite� 5210�, a new fast cure thixotropic silicone material ideal for devices that find end-use within harsh environments. With improved production throughput, operating temperature flexibility and easy storage, Loctite 5210 offers manufacturers a cost-effective alternative to traditional hot-melt glues or less aesthetically pleasing silicones.
