Industry Directory | Manufacturer
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
Ellsworth Adhesives has trained adhesive application specialists available to assist you with any requirements or questions that you may have related to adhesives, sealants, coatings and tapes, or the dispensing of them.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Electronics Forum | Thu May 28 22:12:18 EDT 2009 | davef
If your newer board passes a tape test, you should be OK.
Electronics Forum | Wed Feb 15 08:02:04 EST 2006 | davef
Se�or Tech Search the fine SMTnet Archives. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25210 Roger Saunders, President, Saunders Technology summarized the pros and cons of taping thermocouples as [He's taking about Ka
Used SMT Equipment | Pick and Place/Feeders
Model KE 2050M Board size (330×250mm) Component height 6MM Laser recognition 0603(0201) ~20×20mm or 26.5×11mm Placement speed 13200CPH Feeder inputs Max. 80 on 8mmT/F(※7) Power supply 200 to 415 VAC, 3-phase
Used SMT Equipment | Pick and Place/Feeders
FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Industry News | 2013-10-10 09:56:45.0
GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.
Parts & Supplies | Pick and Place/Feeders
Juki CF03HPR FEEDER 0201 Specs: 40081758 CF03HPR 8mm TAPE FEEDER UNIT FOR 0603 40081759 CF05HPR 8mm TAPE FEEDER UNIT FOR 1005 40081760 CF08HER 8mm TAPE FEEDER UNIT (2MM PITCH) 40081761 CF081PR 8mm TAPE FEEDER UNIT 40081762 CF081ER 8
Parts & Supplies | Pick and Place/Feeders
Juki CF03HPR FEEDER 0201 Specs: 40081758 CF03HPR 8mm TAPE FEEDER UNIT FOR 0603 40081759 CF05HPR 8mm TAPE FEEDER UNIT FOR 1005 40081760 CF08HER 8mm TAPE FEEDER UNIT (2MM PITCH) 40081761 CF081PR 8mm TAPE FEEDER UNIT 40081762 CF081ER 8
Technical Library | 2013-02-07 17:01:46.0
Silicone contamination is known to have a negative impact on assembly processes such as soldering, adhesive bonding, coating, and wire bonding. In particular, silicone is known to cause de-wetting of materials from surfaces and can result in adhesive failures. There are many sources for silicone contamination with common sources being mold releases or lubricants on manufacturing tools, offgassing during cure of silicone paste adhesives, and residue from pressure sensitive tape. This effort addresses silicone contamination by quantifying adhesive effects under known silicone contaminations. The first step in this effort identified an FT-IR spectroscopic detection limit for surface silicone utilizing the area under the 1263 cm-1 (Si-CH3) absorbance peak as a function of concentration (µg/cm2). The next step was to pre-contaminate surfaces with known concentrations of silicone oil and assess the effects on surface wetting and adhesion. This information will be used to establish guidelines for silicone contamination in different manufacturing areas within Harris Corporation... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2020-10-14 14:33:36.0
Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative thermal interface materials like silicones, greases, tapes, or pads. The paper discusses key attributes for designing and formulating advanced thermally conductive epoxies. Comparisons to other common fillers used in packaging are made. The filler size, shape and distribution, as well as concentration in the resin, will determine the adhesive viscosity and rheology. Correlation's between Thermal Resistance calculations and adhesive viscosity are made. Examples are shown that determination of thermal conductivity values in "bulk" form, do not translate into actual package thermal resistance. Four commercially available thermally conductive adhesives were obtained for the study. Adhesives were screened by shear strength measurements, Thermal Cycling ( -55 °C to 125 °C ) Resistance, and damp heat ( 85 °C / 85 %RH ) resistance. The results indicate that low modulus Boron Nitride filled epoxies are superior in formulation and design. Careful selection of stress relief agents, filler morphology, and concentration levels are critical choices the skilled formulator must make. The advantages and limitations of each are discussed and demonstrated.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Events Calendar | Wed Jun 20 00:00:00 EDT 2018 - Wed Jun 20 00:00:00 EDT 2018 | ,
Consider the options-How should I mask for Conformal Coating?
Events Calendar | Wed Jun 21 00:00:00 EDT 2017 - Sat Jun 24 00:00:00 EDT 2017 | Bangkok, Thailand
Assembly Technology Expo
ORION Industries | http://orionindustries.com/pdfs/3MPR0DUCTSUMMARY.pdf
3M Product Summary Thin Bonding Adhesive Transfer Tape Click on Product to View Data Page Adhesive PRODUCT LINER Application Description ADHESION TEMP RANGE Family Caliper Type Caliper Metal HSE LSE
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