Electronics Forum | Fri Aug 30 16:25:21 EDT 2002 | davef
Imm silver holds-up to multiple thermal cycles very well. The things, we guess, are happening to make imm silver tough to solder after heating and sitting are: * Oxidation of the silver. * Reduction of the co-deposited organic anti-tarnish [used in
Electronics Forum | Sun Sep 21 10:55:52 EDT 2008 | vladig
As long as the surface is solderable, you should be fine. Silver tarnish a well0-known thing. Make sure, though, there is no sulfur (S) "around". Regards, Vlad
Electronics Forum | Tue Jul 13 16:35:25 EDT 2004 | Richard
Sounds like your Si plalladium finish has oxide on it from the firing or sitting around too long. I used to assemble LTCC and have had plenty of dealings with this matter. The best and easiest is to get an active type flux and solder paste. AIM makes
Electronics Forum | Thu Apr 20 17:16:02 EDT 2006 | GS
Silver tarnish on lead could compromise the soldering, mainly in case of No Clean process. Make sure components are correctly packaged and stored. Check the vintage ( Manufacturing Data Code) and in order to avoid them to get old on shelf make sure F
Electronics Forum | Wed Apr 26 10:27:37 EDT 2006 | slaine
weve hand soldered a few components that were tarnished with no problems, also the tarnish is electrically conductive if it helps.
Electronics Forum | Thu Jun 08 16:12:19 EDT 2017 | davef
Your plater's recommendation should work fine. Your simple copper plate will work, but you'll be stepping into fighting a copper tarnish battle. Silver over the copper is a better choice. I was thinking a silver thickness of a minimum of 3 microns
Electronics Forum | Wed Aug 27 18:28:29 EDT 2008 | blnorman
We have an immersion silver board that has a brown discoloration after processing. It's not flux residue, that normally doesn't cause this condition. Elemental analysis shows less than 1% sulfur, and I thought silver sulfide is more a black color.
Electronics Forum | Wed Sep 03 16:15:30 EDT 2008 | blnorman
Elemental is by SEM/EDX. The brown coloration does resemble the 3 micron photo. Again, if I'm picking up copper (our Ag plating thickness requirements are 0.05 micron to 0.12 micron following IPC 4553), maybe we do have a porous silver plating.
Electronics Forum | Fri Aug 29 10:18:31 EDT 2008 | rrpowers
We saw this one time when we were trying to develop some lead-free product. It ended up being copper migration. Some of the pads had a brown discoloration and those that did would not wet very well. Your elemental analysis would have shown if ther
Electronics Forum | Wed Sep 09 09:57:15 EDT 2009 | mikesewell
You mention silver pcbs - baking will accelerate oxidation/tarnishing of the finish. Solderability will likely go down...
