Electronics Forum | Mon Feb 05 07:02:11 EST 2007 | CL
ASIR, Findings for us so far: OSP- has worked well for us for single sided boards only. We have seen problems with using it on double sided reflow applications. Also, some customers have specified OSP, but are intolerant of exposed copper. Limited
Electronics Forum | Thu Jul 21 10:40:37 EDT 2011 | blnorman
What is the metal finish? Silver, HASL, Tin??
Electronics Forum | Thu Jan 12 17:35:34 EST 2006 | russ
We use immersion Silver for all of our lead free PCBs. They come in the "silver saver" paper you speak of and we have found that they will tarnish after 7 days in the open enviroment. Even with this tarnish we experienced no reflow problems. We are
Electronics Forum | Wed Aug 05 07:46:46 EDT 1998 | Earl Moon
| We have mixed to negative feelings about Omikron, but I beileve it is due to problems with the board fabricator rather than the process itself. When done properly, our Omikron boards have had very good solderability. However, we have had several
Electronics Forum | Sat Feb 16 07:21:17 EST 2019 | SMTA-Joe
I am experiencing a "tarnishing" issue on PWB traces that may be causing problems with component reflow. The PWB traces are made to the following spec: SOLDER MASK OVER BARE COPPPER WITH SILVER IMMERSION PLATING PER IPC4553, PLATING TO BE 8-12 MIC
Electronics Forum | Mon Feb 18 07:49:17 EST 2019 | SMTA-Joe
the tarnishing is happening across all the traces without solder even being applied. The PCB is soldered into the housing first. Once this is complete the traces have changed, and when it is time to solder the components to the traces this tarnishing
Electronics Forum | Mon May 13 16:20:10 EDT 2002 | ian
Are you refering to MacDermid Sterling Silver finish or immersion silver in general. We have had enquiries about Sterling Silver from a customer and the blurb I have read looks very good (don't most sales literature). Has anyone tried this finish? O
Electronics Forum | Fri Jan 11 17:14:13 EST 2002 | davef
We have one product with electroless nickel, immersion silver solderability protection. We do not purport to be experts, but like many things, have seemingly boundless opinions. Side note: There are a least three different [maybe five] imm silver
Electronics Forum | Thu May 09 17:13:10 EDT 2002 | davef
We are converting all our ENIG to imm silver. CHARACTERISTICS * Nominal thickness of the deposit will be 0.1 to 0.3 microns. * Deposit is flat and uniform * It will withstand multiple heat cycles in assembly, which can be problematic with tradition
Electronics Forum | Mon Feb 18 07:52:09 EST 2019 | SMTA-Joe
Would increasing the thickness to compensate be a reasonable soulluction? This tarnishing is happening after the first time heat is applied. Could it be a factor of too long in ramp and/or soak?
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