Used SMT Equipment | SMD Placement Machines
Highly flexible inline placement system with laser centering, intelligent feeder bus with up to 100 feeders, CCD-camera for teach-in, automatic fiducial recognition system, 3-stage conveyor system with SMEMA connection, automatic tool changer with 5
Used SMT Equipment | SMD Placement Machines
Highly flexible inline placement system with laser centering, intelligent feeder bus with up to 100 feeders, CCD-camera for teach-in, automatic fiducial recognition system, 3-stage conveyor system with SMEMA connection, automatic tool changer with 5
Used SMT Equipment | Screen Printers
right, right--> left, left-> left, right--> right, pass through Conveyor configuration front or rear fix PCB transport width adjustment motorised, software controlled PCB warpage 1% of PCB diagonally, up to a max. of 11 mm including PCB thickness S
SCALABLE, COST-EFFECTIVE SOLUTION FOR HIGH-MIX & NPI Combines the capability, flexibility, and reliability you expect from Panasonic’s award-winning NPM and PanaCIM® Manufacturing Execution System (MES) into a cost-effective, high-mix solution. T
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Used SMT Equipment | General Purpose Equipment
Samsung Auto Pick and Place Machine 7500 pph,Lead Screw Refurbished w/ 15 8mm Feeders 2 Heads, InLine A fast (7,500 cph) machine with a long history of reliability that’s ideal for assemblers on a small budget who require high throughput. Fast and
Used SMT Equipment | Chipshooters / Chip Mounters
Features: Fast Changeover for high mix environment. Re-configurable to A, B, or C types (A type – 8X8 heads, B type – 3X3 heads, C type – 8X3 heads) Flexible Heads- Large part ranges High Speed head- 0402(01005) – 24mm2 Multi Fu
Used SMT Equipment | Labeling Systems
CTI Systems In-Line Laser Marker Model: A-MS2-10W/C02-2-1M-3387 Vintage: 2014 10 Watt C02 Synrad Laser Fume Extractor 1.0Meter wide footprint with 16″ W x 18″L PCB capability Fiducial correction and live teach/view camera. Secondar
New Equipment | Solder Paste Stencils
DESEN Classic 1008 SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
New Equipment | Solder Paste Stencils
DESEN Navigator SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±20μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum Print Area 6
