SCT Group specializes in marketing communications for Technology OEMs.We provide Hybrid� Advertising Brochures Copywriting Collateral Graphics Design Datasheets Direct Mailers Literature Logos Product Package Design Public Relations Technical Writing Editorial Placement Trade Show Booth Graphics Web Site Content Development Design
Industry Directory | Marketing Agency
Chartered Engineer (MIET) writes technical and marketing content for electronics manufacturing, design and software companies.Website, blog and magazine copy for engineers and decision-makers
Marketing and Technical Copywriting I am a Degree-qualified Chartered Engineer (MIET) who writes technical and marketing copy for electronics manufacturing, design and software companies. I have particular experience with inspection and test equipm
Tiger Technology Consulting focuses on partnering with client organizations that maintain the same level of integrity, ethics and responsibility that we have built our firm on. Positions are screened so as to provide opportunities that are career enh
Electronics Forum | Tue May 05 19:32:21 EDT 1998 | Wayne Bracy
Cnuli Jia: Thanks for the nicely spoken message. We will check the new mart out shortly. Most of us enjoy reading the technical writings and will input advise or suggestions from time to time. Thanks Wayne
Electronics Forum | Sat Mar 06 06:16:30 EST 1999 | VJ Pathak
I need to attach / assemble Flexible circuit onto Rigid PCB without use of any connectors i.e. fingers / tracks of Flexible circuit are to be attached / directly to the fingers of the Rigid Glass Epoxy PCB. I need info on the alternate processes, e
Industry News | 2003-05-29 08:30:31.0
Losses halved in the first half year � New organization of electronics group next on the agenda
Industry News | 2015-02-15 17:55:40.0
The best technical conference paper of IPC APEX EXPO 2015 has been selected. Voted on through a ballot process by members of IPC’s Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, February 24.
Technical Library | 2015-12-02 18:32:50.0
(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.
The IPC-7711 & 7721 Instructor course is built on a train-the-trainer model. Upon completion of the course, students will know the technical guidelines of IPC-7711 and 7721 and have demonstrated the proficiency necessary to perform rework and repair
Shenzhen zhuomao is located in Shenzhen, China.SHENZHEN ZHUOMAO TECHNOLOGY CO.,LTD - Seamark Group The leading manufacturer of BGA/SMT rework, X-ray inspection system, TV LCD panel laser repair for 13 years in China. Established in 2005, we have coo
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Career Center | Austin, Texas USA | Engineering,Production
Requirements: � Provides engineering solutions for cost effective and efficient operations while using compliant change control procedures. Responsible for investigate and manage improvement costs, communicate changes, and reporting performance. �
Career Center | Lower Mid-West, Indiana USA | Engineering,Maintenance,Technical Support
* Install, set up and troubleshoot technical problems on the production equipment * Modify and write programmable control software; * Install programmable controls with wiring * Install electronic equipment * Provide technical assistance to the plant
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
Career Center | toronto, toronto Canada | Engineering
Technical Skills • Plan, Design, Implement , Build Electronic Devices according to specifications • Inspect, Diagnose, Repair, Replace, Calibrate, Modified Electronic Devices • Use Blue Prints, Drawings, Diagrams, Measuring instruments Computer Ski
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I.C.T Reflow Oven Introduce Reflow Oven Factory Photograph I.C.T Team News News Trade Info Company News SMT Technical Products Reflow oven Reflow Soldering Oven I.C.T
| https://www.eptac.com/ask/j-std-001fs-space-addendum-module-6-certificate/
. You can no longer buy the certificates as they all now are on line from the IPC. When you create the class on the IPC Portal, just write it in the box that they took and passed the 001 Space Addendum
