Conformal coatings used by electronic manufacturers contain UV indicators for the purpose of inspection. Since coatings are transparent, units must be viewed under black light in order to verify coverage and non-coverage. The Nordson YESTECH FX-940U
PCB magazine unloader/Multi magazine unloader how to receive the PCB after soldering, more detail check :https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/91.html Multi Magazine PCB unloader is used at the end of the SMT line for unlo
MPM Printer: EdgeLoc™ uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps for optimum accuracy and repeatability.
Events Calendar | Wed Apr 18 00:00:00 EDT 2018 - Thu Apr 19 00:00:00 EDT 2018 | ,
Stencil Printing Process and Solder Paste Inspection – An In-Depth Look - SMTA Webtorial
Events Calendar | Mon Nov 19 00:00:00 EST 2018 - Mon Nov 19 00:00:00 EST 2018 | ,
Hand Soldering & De-Soldering with Lead-Free Solder - Webinar
Events Calendar | Mon Feb 11 00:00:00 EST 2019 - Mon Feb 11 00:00:00 EST 2019 | ,
Webinar: Solder Paste Evaluation & Simple Tricks of the Trade
Events Calendar | Mon Jan 31 00:00:00 EST 2022 - Thu Feb 03 00:00:00 EST 2022 | Honolulu, Hawaii USA
Pan Pacific Microelectronics Symposium
Events Calendar | Thu Apr 25 00:00:00 EDT 2024 - Thu Apr 25 00:00:00 EDT 2024 | 1146 Budapest, Dózsa György út 1,
Advanced Electronics Assembly Conference (AEAC) at Innoelectro Budapest
Industry News | 2008-06-06 23:46:12.0
MINNEAPOLIS, MN � SMTA and CALCE of the University of Maryland are pleased to announce the 2nd Annual Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts will be held on September 9-10, 2008 at the University of Maryland, College Park, MD.
Industry News | 2011-10-08 18:45:48.0
Flexible printed circuits are electro – mechanical devices. They require sound design practices to be successful. This presentation will cover these design techniques which focus on stress management and the flex material properties which drives these design techniques resulting in robust flex circuit designs.
