Industry News | 2012-03-21 17:42:19.0
For many designers and manufacturing personnel in the electronics manufacturing supply chain, IPC-AJ-820, Assembly and Joining Handbook, is the document of choice for all aspects involved in creating a PCB.
Technical Library | 1999-08-27 09:24:56.0
Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given.
Technical Library | 1999-08-27 09:29:49.0
Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...
Technical Library | 2019-10-16 10:20:25.0
A major goal of the development of advanced packaging technology is to reduce the size, weight, and power consumption of electronics components using state-of-the-art commercial technologies. One of the novel concepts involves the use of all three spatial dimensions when designing and producing new systems. In the past, electronic structures tended to be two dimensional in nature. Generally speaking, individually packaged integrated circuit (IC) dies were interconnected on printed circuit boards. Techniques such as die and package stacking naturally contribute to a reduction of the spatial footprint of any given electronic system design.
Industry News | 2023-08-01 03:54:42.0
The aerospace industry has been a driving force behind technological innovation, with its advanced technologies finding increasing applications in other fields. This article explores how aerospace technology is employed in Surface Mount Technology (SMT) and Through-Hole Technology (THT) devices, ushering in new development opportunities for the electronics manufacturing sector.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | ON DEMAND | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | ON DEMAND | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | ON DEMAND | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | ON DEMAND | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
