Industry News | 2008-08-21 13:06:34.0
New RIGOL Digital Storage Oscilloscopes and Mixed Signal Oscilloscopes to be Distributed by Test Equipment Connection
Industry News | 2010-04-06 11:33:47.0
Test Equipment Connection Corp. announced today that is has entered into a Reseller Agreement to market and sell new Frederick Engineering network management, security, and analysis solutions.
Industry News | 2010-04-11 03:35:31.0
MILPITAS, Calif. — Bliss Industries Inc., provider of material handling carts and racks for PCB assembly, has awarded Technical Resources Corporation Outstanding Representative of the Year from the Sales Manager. The awards were presented to the company during a Tuesday, April 6, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas during APEX 2010.
Industry News | 2010-09-07 09:29:29.0
Lake Mary, FL - September 7, 2010 - Test Equipment Connection announced today that it has entered into a Distribution Agreement to sell new Triveni Digital systems that provide for the management and distribution of data and metadata in digital television streams and other broadcast and multicast media.
Industry News | 2014-03-27 12:50:46.0
The "ElectroTestExpo" consortium is pleased to announce the dates for its regional PCB test and debug exhibitions to be held during 2014. Now enjoying its fifth consecutive year of free-to-attend events, ElectroTestExpo will commence its unique combination of drop-in tabletop exhibition and seminar on June 18th at one of the UK's main electronics and research hubs - the Cambridge Science Park (the Trinity Centre).
Industry News | 2015-01-26 14:18:06.0
Now enjoying its sixth consecutive year of free-to-attend events, ElectroTestExpo will commence its unique combination of drop-in tabletop exhibition and seminar on March 25th at one of the UK’s most unique attractions – the National Space Centre, Leicester.
Industry News | 2016-07-07 14:47:47.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
Industry News | 2009-11-01 18:10:15.0
The SIPLACE Team is so confident in its new affordable SIPLACE SX concept of "Real Capacity on Demand" that they have taken to the road in the Americas to spread the word. The SIPLACE team is performing live gantry upgrade demonstrations at record breaking speeds. The team is revealing how quickly and easily you can add placement performance to a line without influencing feeder capacity or line length; how easily placement capacity can be moved from one line to another; and how easily feeder capacity can be added without the cost of adding an entire new machine.
Industry News | 2016-05-21 07:36:35.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
Used SMT Equipment | In-Circuit Testers
Tektronix WFM7120-AVD-CPS-DAT-DDE-EYE-HD-PHY-SD-SIM Waveform Monitor The WFM6120 / WFM7020 / WFM7120 family provides Tektronix' superior video waveform monitoring and analysis capabilities required in Content Creation, Content Delivery, Researc
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