New Equipment | Board Handling - Storage
Surface Mount Process Carriers are engineered to completely fixture a circuit board during the overall assembly process. These carriers are made of high-temperature semi-conductive composite materials, used from start to finish in the assembly proces
Industry Directory | Manufacturer
For everything from high volume, low cost capacitors to application specific ceramic solutions, Johanson Dielectrics has you covered.
Used SMT Equipment | General Purpose Equipment
Blue M Oven Model POM-206B 208VAC Single Phase, 60 cycle, 1/4 HP Motor, * Max Temp 343 C * Internal Oven Dimensions: 20-(wide) x 18-(deep) x 20-(high) * External Oven Dimensions: 42-(wide) x 32-(deep) x 50-(high) * Temperature Maximum: 650F (for
Used SMT Equipment | Stencil Cleaners
Programmable digital wash cycle timer Wash solution heating system with programmable digital temperature controller Closed-loop wash solution filtration system with stainless steel housing Closed-loop rinse water filtration system with stainless s
Used SMT Equipment | Soldering - Reflow
A8N Main electric part uses international brand components. Temperature control design achieves international advanced level with stable and even temperature. It is suitable for soldering CSP, BGA component. Energy-saving inner oven design and heat
Used SMT Equipment | Repair/Rework
SRT (Sierra Research and Technology) Summit 1100 Automated Workstation Vintage: August 2000 Voltage: 208V Single Phase Includes (2) Computers and (1) Flatscreen Display The Summit 1100 is a semi-automated system for prototyping, light
Technical Library | 2018-05-17 11:14:52.0
Intermetallic compound (IMC) growth is being studied in earnest in this past decade because of its significant effect the solder joint reliability. It appears that from numerous investigations conducted, excessive growth of IMC could lead to solder joint failure. Leading to this, many attempts has been made to determine the actual IMC thickness. However, precise and true representation of the growth in the actual 3D phenomenon from 2D cross-section investigations has remained unclear. This paper will focus on the measuring the IMC thickness using 3D surface profilometer (Alicona Focus G4). Lead free solder, Sn3.0Ag0.5Cu (SAC305) was soldered onto copper printed circuit board (Cu PCB). The samples were then subjected to thermal cycle (TC) storage process with temperature range from 0 °C to 100 °C for 200 cycles and up to 1000 cycles were completed.
Technical Library | 2016-01-12 11:05:28.0
The electronic industry is currently very interested in low temperature soldering processes such as using Sn/Bi alloy to improve process yield, eliminate the head-in-pillow effect, and enhance rework yield. However, Sn/Bi alloy is not strong enough to replace lead-free (SAC) and eutectic Sn/Pb alloys in most applications. In order to improve the strength of Sn/Bi solder joints, enhance mechanical performance, and improve reliability properties such as thermal cycling performance of soldered electronic devices, YINCAE has developed a low temperature solder joint encapsulant for Sn/Bi soldering applications. This low temperature solder joint encapsulant can be dipped, dispensed, or printed. After reflow with Sn/Bi solder paste or alloy, solder joint encapsulant encapsulates the solder joint. As a result, the strength of solder joints is enhanced by several times, and thermal cycling performance is significantly improved. All details will be discussed in this paper.
New Equipment | Soldering - Other
right ( or Right -> left ) Transport Band Height 900±20mm Transport Method Stainless steel mesh belt , mesh spacing 10 mm Transport Velocity 0-800mm/min
