New Equipment | Board Handling - Pallets,Carriers,Fixtures
Stentech has advanced capabilities in machining and drilling composite materials. Stentech can provide a wide range of manufacturing solutions for wave solder pallets that are custom-engineered and manufactured to each client's specifications. The u
Industry News | 2020-11-06 04:01:25.0
Temperature humidity test chambers replicate both the humidity and temperature of the environment. Humidity readings at intense temperatures signal to testers how they react to cold, hot, humid, and arid conditions in various mixes. Controlling humidity is hard without maintaining temperatures.
New Equipment | Board Handling - Pallets,Carriers,Fixtures
We take pleasure to introduce ourselves as one of the renowned Exporter, Manufacturer & Supplier of Anti-Static ESD Acrylic PMMA Sheet in Shenzhen, Guangdong, China. Properties Test Method Unit Value Physical Properties Density ASTM D792 g/cm³ 1.19 W
Industry News | 2021-01-05 11:01:03.0
New Vishay Siliconix 40V Automotive Grade MOSFET Provides Lower Thermal Resistance and a Lead Frame for Extended Board-Level Reliability
New Equipment | Cleaning Equipment
WORLD’S FIRST AQUEOUS CLEANER / TESTER The Aqua ROSE™, from Austin American Technology, introduces a new era to batch cleaning / Ionic Contamination Testing. Now experience a batch cleaner that offers multiple cleaning and testing technologies for c
Lead-Free Desktop Reflow Oven with tempereture cure T200N+ Lead-Free Desktop Reflow Oven with tempereture cure T200N+ Product Description Product Description: T200N+=nitrogen lead free reflow oven T200N+temperature tester T200N+ is not o
Low Pressure Molding with Macromelt. Low pressure molding is an innovative manufacturing process between injection molding and potting. A cost effective and environmentally friendly alternative to epoxy potting for fragile electronic components. When
100% ESD material, thicknesses ranging from 3mm-12mm. (with cycles through a wave solder machine reaching 250,000 cycles)-(color-black)-fine woven glass with a special high temperature resin system
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
RF8810 High Precision SMT Reflow Oven - Professional Reflow Soldering Machines Characteristics: 1.Competitive price for quality 2. Eight years manufacturing experience 3.True Leader of Smt machines manufacturer in China Leadsmt the mainstream man
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