New Equipment | Assembly Services
TG-1000 Hot Bar Bonding System TG-1000 is a feature rich, floor standing bonding system designed for process development and high mix production environments. Standard features include: • Floor standing base frame & leveling legs with righ or left
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
Quick Overview Max 180 x 235mm soldering area Infrared IC Heater T962 is a micro-processor controlled reflow oven, works automatically by micro-computer control. It can satisfy a dissimilarity SMD、BAG soldering a request on a PCB assembly. The T962
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Durostone® Solder pallets Durostone® Solder pallets - perfectly machined A good example to show the precision of our machining are Durostone® PCB solder pallets. They are used to fix electronic components on printed circuit boads using the wave sold
Wouldn't it be nice to see into the future? With Sherlock by DfR Solutions, you can. Sherlock is a new Automated Design Analysis Tool that allows you to predict product failure earlier in the design process, allowing you to design reliability right
Industry News | 2021-02-17 13:05:46.0
New Flat Pack Series Supplies Twice the Capacitance and Lifetime Hours of Devices in the Same Class
New Equipment | Test Equipment
Application: thermistor temperature measurement for refrigerator, freezer, deep-freezer, ice cube makers, counter drinks cooler, backbar and catering coolers, display fridges, wine coolers, and other HVAC application, etc. ABS Plastic NTC thermistor
Used SMT Equipment | Soldering - Reflow
Vitronics XPM3-1240 (2007) Reflow oven Brand: Vitronics Model: XPM3-1240 Mfg: 2007 Power: 58Kva Voltage: 3x480-V Cycles: 50/60 Hz Air pressure: 69psi/ 4.8bar Air consumption: 2648cfh/ 10m3/h Full load: 70A Largest load: 12A Interrupt cap
Used SMT Equipment | Semiconductor & Solar
LPKF Multipress II 2005 220VAC Single phase Appears to be in like new condition. Powers up and cycles. FOB: Origin Also available: LPKF Bench top printer and LPKF Zelflow bench top reflow oven. Contact: AssuredTechnicalServiceLLC@Gmail.com
Used SMT Equipment | Assembly Accessories
LPKF Multipress II 2005 220VAC Single phase Appears to be in like new condition. Powers up and cycles. FOB: Origin Also available: LPKF Bench top printer and LPKF Zelflow bench top reflow oven OEM Description: Footprint: approx. 0.25 m²
