Industry Directory | Manufacturer
Digicom provides turn-key electronics manufacturing solutions for prototype to volume production builds, PCB assemblies, and complete box-build systems.
Industry News | 2020-11-19 20:55:18.0
Temperature cycling test or thermal cycle testing is done on substances to determine the immunity of vulnerability to alternating extremes of low and high temperatures. You can utilize temperature cycling test chambers to test nearly all commercial goods to determine how they withstand extreme temperature changes. The intent of analyzing a product under these conditions is to detect changes in the goods' characteristics and assess the failure incidence of distinct substances and thermal expansion coefficients.
Technical Library | 2009-05-21 13:41:05.0
Failure due to board flex cracks persists as the dominant failure mode in multi-layer ceramic capacitors (MLCC). (...) This paper is intended to show the impact of temperature cycling, high-temperature life tests, and multiple bend exposures to the MLCC with this flexible termination.
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Parts & Supplies | Soldering - Reflow
This reflow oven is top quality oven represent the world's best low cost, high performance solder reflow sytem. The sensor is designed in the front of tip and the temperature induction is very exact and sensitive, the speed of heating and recovery of
All electronic hardware is susceptible to the damaging effects of moisture, temperature, and contaminants. STI understands the criticality of reliability testing and test-to-failure. Improper selection of assembly materials and manufacturing processe
Parts & Supplies | Soldering - Reflow
Brand New SMT2010 TABLE-TOP REFLOW OVEN LEAD-FREE Description: This is a brand new, SMT2010 Reflow oven. More and more surface mount devices (SMD) are used on electronic circuit boards. Large floor model reflow ovens are expensive and heavy, no
Technical Library | 2023-11-27 18:19:40.0
This page introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Ceramic Chip Capacitors). Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions after going on the market and during manufacturing processes such as soldering. Applications and boards that specially require solder crack countermeasures Solder cracks occur mainly because of thermal fatigue due to thermal shock or temperature cycles or the use of lead-free solder, which is hard and fragile.
Used SMT Equipment | Soldering - Reflow
Desk Reflow Oven Features: Cost-effective Desk Reflow Oven utilizes forced air convection heating technology and PC software interface to make an accurate temperature profile quickly and easily. T200 is a fine temperature profile model wit
Reflow cycle - runs the oven through the pre-defined temperature profile.> Bake cycle - used to drive the moisture from moisture-sensitive components.>
