Industry News | 2020-11-25 21:23:15.0
Each of the conducting processes should be performed, maintaining the test standard assortment of every test's execution. Temperature Cycling Test Chamber at the equilibrium indicates correct evaluation in particular data performance. So, it is a more precise detection of the following test results. Since particular conditions can affect its assessment, it can't run correctly. It means a reduction of inaccurate test results, which is immeasurable. That's why it's vital to make sure this tests' expected behavior is completed in the instance of preparations.
Industry Directory | Manufacturer
We are Wave Technology from India. We are Electronic Manufacturing Services provider, we do PCB assembling services for all the electronics product.
Used SMT Equipment | Soldering - Reflow
Desk Reflow Oven Features: Cost-effective Desk Reflow Oven utilizes forced air convection heating technology and PC software interface to make an accurate temperature profile quickly and easily. T200N is a fine temperature profile model with te
New Equipment | Assembly Services
Multiiple assembly lines and highly trained staff support IPC level 1, 2, and 3 assembly of both surface mount and through-hole technology products. PCB assembly we offer: Surface mount, including BGAs and micro-BGAs Through-hole Mixed
Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package
Technical Library | 2009-05-07 23:23:00.0
Thermal fatigue has been one of the most serious problems for solder joint reliability. Thermo-mechanical fatigue failure is considered to be closely related to micro-structural coarsening (grain/phase growth). Factors that influence the phase growth are studied and measurement methods are discussed, including the preparation of the eutectic solder sample for phase size measurement. Three categories of models used to predict grain growth in polycrystalline materials are presented. Finally, phase growth in solder during high temperature aging and temperature cycling and its use as a damage correlation factor are discussed.
Technical Library | 2022-01-26 15:22:33.0
Reliability of conformal coatings used to mitigate tin whisker growth depends on their ability to contain tin whiskers. Two key material properties required to assess the reliability of a polyurethane coating are documented experimentally: adhesion strength and puncture strength. A modified blister test using a predefined blister area is employed to assess the adhesion strength and a puncture test is employed to evaluate the puncture strength of the coating. After measuring the properties at time zero, the coatings are subjected to accelerated testing conditions (high temperature/humidity storage and temperature cycling) and the degradations of the coating properties are documented.
Used SMT Equipment | Repair/Rework
Hakko 485-V12 Soldering Station is a compact soldering system designed for soldering and de-soldering components and connectors on PC boards. Unit includes full pot of SAC 305 No Lead Solder. Solder flow is time-controlled and temperature-controll
Industry News | 2020-09-28 22:54:44.0
Compared with other international lithium battery standards, the temperature cycling conditions specified in the UN38.3 standard are more demanding and longer.
New Equipment | Test Equipment
A temperature control system for high-speed and high-temperature testing of components, sensors, and PCBs has been introduced by inTEST Thermal. The Thermostream® ATS-750 delivers clean dry air from -90 to 300C to support growing demands for testing
