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Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber

Technical Library | 2015-07-16 17:24:23.0

Qualification of electronic hardware from a corrosion resistance standpoint has traditionally relied on stressing the hardware in a variety of environments. Before the development of tests based on mixed flowing gas (MFG), hardware was typically exposed to temperature-humidity cycling. In the pre-1980s era, component feature sizes were relatively large. Corrosion, while it did occur, did not in general degrade reliability. There were rare instances of the data center environments releasing corrosive gases and corroding hardware. One that got a lot of publicity was the corrosion by sulfur-bearing gases given off by data center carpeting. More often, corrosion was due to corrosive flux residues left on as-manufactured printed circuit boards (PCBs) that led to ion migration induced electrical shorting. Ion migration induced failures also occurred inside the PCBs due to poor laminate quality and moisture trapped in the laminate layers.

iNEMI (International Electronics Manufacturing Initiative)

New G4C Ceramic Hot Bars (Thermodes)

Industry News | 2014-07-16 20:05:16.0

Backward Compatible G4C Ceramic Hot Bars Designed for Legacy TC-1000 and TC-1200 Toddco Temperature Controllers

Toddco3

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

T2000 SD

New Equipment |  

100% ESD material, thicknesses ranging from 3mm-12mm. (with cycles through a wave solder machine reaching 250,000 cycles)-(color-black)-fine woven glass with a special high temperature resin system

MSC Morkstar Corporation

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

New Equipment | Assembly Services

TG-1000 Hot Bar Bonding System TG-1000 is a feature rich, floor standing bonding system designed for process development and high mix production environments. Standard features include: • Floor standing base frame & leveling legs with righ or left

Toddco3

Johanson Dielectrics, Inc.

Industry Directory | Manufacturer

For everything from high volume, low cost capacitors to application specific ceramic solutions, Johanson Dielectrics has you covered.

Aqueous Technologies AQ-201

Aqueous Technologies AQ-201

Used SMT Equipment | Stencil Cleaners

Programmable digital wash cycle timer Wash solution heating system with programmable digital temperature controller Closed-loop wash solution filtration system with stainless steel housing Closed-loop rinse water filtration system with stainless s

PCB Equipment

Blue M  Model POM-206B Max Temp 343c

Blue M Model POM-206B Max Temp 343c

Used SMT Equipment | General Purpose Equipment

Blue M Oven Model POM-206B 208VAC Single Phase, 60 cycle, 1/4 HP Motor, * Max Temp 343 C * Internal Oven Dimensions: 20-(wide) x 18-(deep) x 20-(high) * External Oven Dimensions: 42-(wide) x 32-(deep) x 50-(high) * Temperature Maximum: 650F (for

Assured Technical Service LLC

Solder Joint Reliability

Industry News | 2018-10-18 08:49:15.0

Solder Joint Reliability

Flason Electronic Co.,limited

SRT Summit 1100

SRT Summit 1100

Used SMT Equipment | Repair/Rework

SRT (Sierra Research and Technology) Summit 1100 Automated Workstation Vintage: August 2000 Voltage: 208V Single Phase Includes (2) Computers and (1) Flatscreen Display The Summit 1100 is a semi-automated system for prototyping, light

Recon Inc


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