New Equipment | Soldering - Other
Weller WSD 81i Set Many parameter are available with this unit Power unit 80 W, 1 channel with soldering iron WSP 80 and safety rest KH 18 Soldering station, 1 channel, 80 W / 230 V Silver-Line Technology Technical Data: Dimensions W x D x
ThermNet simulates the temperature distribution of specified heat sources. Full integration with MagNet provides accurate results for coupled electromagnetic-thermal analysis needs. Here are just some of ThermNet's many useful features: * Simula
Technical Library | 1999-05-06 11:52:21.0
The market's demand for increasingly powerful products, in smaller and smaller packaging, creates a cooling problem. Integrated circuit (IC) lifetime is dependent upon its operating temperature, creating a trade-off situation: either you enlarge the package to accept additional cooling, or you sacrifice IC lifetime.
The Weller WSD 81i 80W soldering stations are a smart, easy to use and efficient digital power unit designed with extra in-built functionality to allow presets to be made without the need of a separate calibration box. These cost efficient stations f
Technical Library | 2023-11-27 18:29:45.0
This paper examines the modeling of viscoplastic solder behavior in the vicinity of interfacial cracking for flip chip semiconductor packages. Of particular interest is the relationship between viscoplastic deformation in the solder bumps and any possible interface cracking between the epoxy underfill layer and the silicon die. A 3-D finite element code, developed specifically for the study of interfacial fracture problems, was modified to study how viscoplastic solder material properties would affect fracture parameters such as strain energy release rate and phase angle for nearby interfacial cracks. Simplified two-layer periodic symmetry models were developed to investigate these interactions. Comparison of flip chip results using different solder material models showed that viscoplastic models yielded lower stress and fracture parameters than time independent elastic-plastic simulations. It was also found that adding second level attachment greatly increases the magnitude of the solder strain and fracture parameters. As expected, the viscoplastic and temperature dependent elastic-plastic results exhibited greater similarity to each other than results based solely on linear elastic properties. !DOI: 10.1115/1.1649242"
New Equipment | Test Equipment
The TherMoiré® PS600S is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 600 mm x 600 mm. With time-temperature profiling cap
The new, powerful WT soldering stations set new standards in user-friendliness.The detailed LC display enables an unprecedented overview of all functions, quick and easy to reach via the new user-friendly menu button. The lightning quick change proce
New Equipment | Test Equipment
3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us
Technical Library | 2014-06-12 16:40:19.0
Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.
WASET - World Academy of Science, Engineering and Technology
New Equipment | Rework & Repair Equipment
Dispensing varied materials across a wide range of viscosities – using the same equipment! Especially solder paste and other filled media have always been particularly demanding when reliable and consistent results are expected. The Clever Dispense e
