Technical Library | 2011-10-20 22:03:30.0
Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal stress alone is not solely caused by differences in coefficients of thermal expansion of individual layers. The emergence of thermal stress is subject to both the layered structure of the wall and given boundary conditions, as well as the existence of a temperature gradient in the direction normal to the surface of the wall. A practical application focuses on the issue of recycling of PCB with the effort to achieve separation of layers due to thermal stress. Role modelling of thermal stress in this area lies in predicting the possibility of separation, depending on the type of thermal stress and material parameters.
Technical Library | 2023-02-13 18:56:42.0
This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.
Industry News | 2020-05-12 11:49:03.0
Indium Corporation's Claire Hotvedt, Product Development Specialist, will host two InSIDER Series webinars focused on the company's innovative low-temperature solder offering on May 12 at 2 p.m. and May 13 at 8 a.m. EST.
1．Description of products ： INFRARED tically by micro-computer control. Can satisfy a dissimilarity SMD、BAG Soldering a request. Whole soldering process to complete automatically, easy to use, Adoption fast infrared radiation and circulation the wi
1．Description of products ： INFRARED IC HEATER T962A works automatically by micro-computer control. Can satisfy a dissimilarity SMD、BAG Soldering a request. Whole soldering process to complete automatically, easy to use, Adoption fast infrared radi
Industry News | 2013-02-07 11:10:53.0
RO-CONTROL and RO-SOFT from Essemtec are state-of-the-art software packages for simulation, control and documentation reflow and curing ovens and processes. Operators, process engineers and quality managers profit from the advanced functionality of the new version 7.
Through Hole Basic Switch Modules, Plunger for Cap, PC Pin Terminals. The Unimec switch range is one of the smallest two pole switches available today. The contacts are capable of producing eight functions depending on the PCB layout. The Unimec sw
Nano Tribometer In Nanotribometry, a flat, a pin or a sphere is loaded onto the test sample with a precisely known force.The friction coefficient is determined during the test by measuring the deflection force on the arm. Wear coefficients for the
Specifications: 1.Overlay Materials: The most commonly used materials are polyester(PET) and polycarbonate(PC). 2. Rear Adhesive: 3M 467MP, 3M 468MP, etc. 3. Matching color: Pantone and RAL color matching system. 4 .Gloss, semi-gloss or matte 5
Specifications: 1.Overlay Materials: The most commonly used materials are polyester(PET) and polycarbonate(PC). 2. Rear Adhesive: 3M 467MP, 3M 468MP, etc. 3. Matching color: Pantone and RAL color matching system. 4 .Gloss, semi-gloss or matte 5
