Electronics Forum | Fri May 31 10:35:46 EDT 2002 | dason_c
I think that the IPC spec only apply to the MSD. I had a paper from Lucent and forwarded by Francois Monette, please aware that the first 2 hours, the moisture doesn't bake out from the assembly/component and result show that it is increase the weigh
Electronics Forum | Thu Aug 05 13:37:28 EDT 2004 | davef
Baking your boards will redue the amount of OSP on the board. If you use the boards quickly, you probably will not have a problem with baking [and don't bake too long]. Why do you want bake this board?
