Electronics Forum | Thu Oct 21 21:26:19 EDT 1999 | Dave F
Yims: There's several threads in the archives on re-useable stencil frames, but they seem to be focused on a limited nubmer of suppliers. I'm trying to take a big picture of the suppliers of these frames. So I'd like to know about: 1 ITT ProFrame
Electronics Forum | Wed May 20 19:55:00 EDT 1998 | D. Lange
| Have you tried the new Accu-Frame from PNC? It tensions on all four sides using an operator-INdependent mechanical scheme. It seems pretty slick. They're failry new, and don't have a frame for the MPM's last time I checked, so I haven't tried it
Electronics Forum | Wed Nov 10 18:02:54 EST 1999 | John Thorup
Hi Dave Sounds like what we call a "squeeze ball". Usually caused by excess paste squeezed over the mask between the pads of the component when placed. This sometimes escapes the pull of surface tension back to the fillet and escapes to the side, us
Electronics Forum | Fri Oct 22 21:35:54 EDT 1999 | se
It's IIT, not ITT. DEK in the UK also uses a tensioning frame, but I don't know of any suppliers in the US. As a stencil vendor without a quick mount/re-usable frame to sell, I can say that I have not heard many complaints regarding print quality o
Electronics Forum | Tue Jan 28 07:10:30 EST 2020 | spoiltforchoice
Looking at buying a new stencil frame. We are a small low volume, high mix place & can changeover stencils several times a day. There are several framing systems out there but most of them are Pneumatic.(VectorGuard,Zelflex,LTC Quattro) I've seen/h
Electronics Forum | Mon Jun 29 13:51:29 EDT 1998 | Russ Miculich
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Mon Jun 29 13:50:48 EDT 1998 | Russ Miculich
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Tue Feb 10 15:13:06 EST 2004 | patthemack
Hey Vinny, Sorry I haven't looked at this for a while. 3 things to try: Tombstoning- The ground plane side is larger because the solder mask allows for a little slop at the board shop (clearance around a pad of a few mils). Since there is not a defi
Electronics Forum | Wed Dec 13 14:15:54 EST 2000 | Chris
I have a product where an IC is soldered using a stencil which puts down way too much paste. The result is massive bridging. Anyway, one of my coworkers claimed he could eliminate the bridging by baking the circuit board in an oven for 5 min at 90
Electronics Forum | Mon Oct 13 13:34:13 EDT 2003 | caldon
HI Andrea- to answer Q: 1) Stencils can be order through various vendors that manufacture stencils. You would need to have CAD data for the Stencil company to make them. You design engineer should have the CAD info. Also, the stencil design company c
