Electronics Forum | Thu Apr 15 10:09:55 EDT 2010 | davef
Dross formation rates for SnCu and SAC are roughly 2.5 times the rate for SnPb (Hwang et al., 2004) Methods for reducing dross are: * Lower pot temperature * Run pump speed slower and only when soldering * Check solder contaminants to BS219, ASTM
Electronics Forum | Fri Nov 22 05:04:07 EST 2019 | SMTA-Matthew
We have some circuit boards where the solder mask seems clear instead of green on top of some of the tented via pads. No gold deposited during the ENiG process and no solder sticks to it but why is it clear and does it have any correlation to the thi
Electronics Forum | Mon Jul 26 18:05:18 EDT 1999 | ScottM
| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F
Electronics Forum | Thu Feb 07 20:53:51 EST 2002 | davef
Regardless of the technique used for the mounting pad shape or definition, isolation of the plated through hole [PTH] from the mounting pad is important. If the PTH is contained within the mounting pad, solder will wick down the PTH. The amount of
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Mon Sep 28 19:07:47 EDT 1998 | Steve Gregory
| I have had some field failures returned recently, the boards had flux contamination under the components in a sensitive area, Nothing really visible until the component was removed, and the board had no evidence of rework of any type. Is it poss
Electronics Forum | Tue Aug 22 14:52:55 EDT 2000 | John Thorup
Jax - absolutely right - the archives are a valuable tool and deserve to be used more than they seem to be. Caumel - Are your blobs on the solder side or the component side? Are your vias tented on the component side? What size are your vias? Is th
Electronics Forum | Mon Apr 02 20:47:22 EDT 2001 | davef
Cuppla questions for ya ... Where are the shorts [above the mask or between the mask and the laminate]? On the board, what material is between the copper traces and the mask? What type of solder mask(s) used by your suppliers? What are they using
Electronics Forum | Mon Oct 18 09:41:56 EDT 1999 | Wolfgang Busko
That should not happen. There are some threads concerning BGA and wavesoldering you could look for. It�s said that you should protect the vias in the BGA-area by soldermask or at least with tented vias to prevent rereflow of BGAs solderjoints what co
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