Electronics Forum | Tue Sep 22 09:59:15 EDT 1998 | Mike C
| Hi Jacqueline! | Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? | If that is true, are there many vias concentrated
Electronics Forum | Tue Sep 29 04:54:23 EDT 1998 | Clive Heke
Thank you Steve for your input it was very usefull. I think I skipped a few pertinant details on my initial message though, the component which we found the flux contamination on was on the top side of the board, I was curious if the flux could come
Electronics Forum | Thu Oct 01 19:07:48 EDT 1998 | Paul R. Smith
Kyung Sam, Justin is correct, there is definately either a board design problem or the PCB maker issue. Obviously there are many mixed technology boards built in the world so I would lean towards a design issue as the root cause. Should you or you
Electronics Forum | Fri Oct 02 01:21:08 EDT 1998 | Mike Cox
Kyung Sam, | | Justin is correct, there is definately either a board design problem or the PCB maker issue. Obviously there are many mixed technology boards built in the world so I would lean towards a design issue as the root cause. Should you or
Electronics Forum | Sat Sep 18 12:10:19 EDT 2004 | Steve Gregory
I have a question about solder masking via's in a BGA pattern, and want to see if I'm thinking correctly about this. This problem is kind of along the same line as Carol's problem earlier. I think it's a bad idea to leave the via's free from solder
Electronics Forum | Thu Sep 16 18:59:14 EDT 2004 | Carol
Thanks Everyone, the information was very useful. We use 7095 as a bible. A-610 6.5.3 doesn't allow for any solder balls not entrapped/attached etc. so we will look again at plugging/tenting both ends of the via. We ran into the problem of the mask
Electronics Forum | Tue Mar 13 17:26:07 EST 2001 | blair
1) We could press on BGAs and the boards would boot 2) This is basic boot up yield 3) We are now getting stpe by step inspection data going fwd. 4) So, Stencil design could be a critical factor. Any documented guidelines? 5) Yes DFX was done - mostl
Electronics Forum | Wed Jul 11 12:26:54 EDT 2001 | mzaboogie
Hi Ian, Answers to your questions: 1) PCB Pad Finishing- HASL 63/37 2)Checked a sample lot of parts. Coplanarity did not seem to be an issue. Some of the parts checked still exibited this condition after reflow. 3) There are no large ground plane
Electronics Forum | Wed May 03 13:34:04 EDT 2023 | proceng1
When we get a bad print at SMT, the operator uses the alcohol wipes and wipes the paste off the board. Then they use compressed air and another wipe. In most cases this is sufficient. Most vias are tented, but there still remains some solder sphere
Electronics Forum | Tue Sep 22 12:25:31 EDT 1998 | Chrys
| | Hi Jacqueline! | | Do these joints that you're having problems with happen to be on fine pitch solder joints? Are the fillets staying attached to the foot and separating from the pads cleanly? | | If that is true, are there many vias concen
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