Full Site - : tenting via (Page 4 of 16)

Tented Via's

Electronics Forum | Thu Feb 21 12:04:32 EST 2008 | pms

That is a correct assumption Doug.

Tented Via's

Electronics Forum | Thu Feb 21 13:12:31 EST 2008 | dphilbrick

Just have your board house take them out of the mask layer.

Tented Via's

Electronics Forum | Fri Feb 22 16:49:44 EST 2008 | pms

Steve, Trying to keep wave solder from coming up the via' from the bottom and adhering to the via's and via's pads during wave. We use WS flux thru-out the whole process. I have been concerned about possible flux intrapment in the via's. That's a g

Tented Via's

Electronics Forum | Thu Feb 21 16:57:02 EST 2008 | flipit

If the vias are large and don't always tent, you can have your pcb supplier double mask the pcb. I do this for COB assembly sometimes because the globtop wicks through the vias and also causes air bubbles in the globtop.

BGA Via Tenting

Electronics Forum | Fri Jan 21 19:30:11 EST 2005 | Dreamsniper

Hi T2, The purpose of this is that we want to make our rework robust. Whenever we rework BGA's we have solder getting trapped into those 1 sided tented vias and bet yah...they are hard to desolder! And during BGA resoldering these trapped solder will

Via holes and Wave Solder

Electronics Forum | Tue Mar 07 08:48:55 EST 2006 | samir

Our ICT Guy here at my company loves to use lots of via holes as test points - via holes which are 0.040" diameter, and spaced at 0.004" edge to edge spacing! He doesn't like to tent the via's either, so I always battle via-to-via shorts at the wave

Tented Via's

Electronics Forum | Thu Feb 21 17:19:08 EST 2008 | davemn

if you are not using them for test points or want them filled with solder for current carrying capability then tent them puppies. i was able to move our company away from exposed vias many years ago and this eliminated lots of hairline shorts between

Tented Via's

Electronics Forum | Mon Feb 25 12:21:16 EST 2008 | stevek

Rather than having the artwork cover the via as with tenting dry film, and letting the mask do what it will, the preferred way is to do a second op silk screen with something like SR1000 just in the vias themselves to plug them. This doesn't always

Micro Solder Balls and Vias bridging Issue

Electronics Forum | Tue Mar 03 02:39:56 EST 2015 | sarason

I would presume you reflow the top of the board first. Use tented vias. As you have worked out, vias have surface tension, which sucks the solder up the hole during reflow of the bottom of the board. Good luck! regards sarason

Via tenting/filling with BGAs

Electronics Forum | Tue Mar 22 08:05:59 EST 2005 | jdumont

Morning all, my question is regarding the use of filled/tented/plugged vias on the BGA site. What are you guys doing for this? What type of issues can this cause if using none, or the improper via design. Regards, JD


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