Electronics Forum | Thu Feb 07 11:59:48 EST 2002 | Ron Costa
When double sided BGA's are used on an .062 FR4 10 layer board should via's be plugged and tented? The CACHE chips being used are PBGA's 1.27mm pitch. The pad size is .030 and the finished via dia. is .010. This is a dogbone type pad and via design.
Electronics Forum | Tue Mar 07 21:35:16 EST 2006 | Cal Kolokoy
Samir, From experience, the only board test situation where tented via's have difficulty with contact is with a Flying Probe type tester. Otherwise, for traditional ICT, the force of the pogo pins, correct probe type, and fixture design should do th
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Tue Nov 27 14:24:13 EST 2001 | mparker
Short term fixes can be: have the vias "plugged" with solder by the fab house. This works if your fab is HASL finish. Tent the vias with solder mask, top side only. You may get a flux entrapment issue in the vias with this manner. Long term fix can
Electronics Forum | Wed Feb 16 09:33:09 EST 2000 | Kurt Waskow
Interested in information regarding PCB soldermask tenting over vias within a BGA layout. Is this a common practice to reduce the occurrence of shorts, are there any reliability concerns? Thanks!
Electronics Forum | Mon Feb 21 08:33:53 EST 2000 | Tony Di Mauro
Kurt, When I was working in a captive manufacturing house we had been to migrate toward tenting all vias under the BGA to eliminate not only shorts but insufficient (Starved) joints. Tony
Electronics Forum | Wed Feb 16 09:33:09 EST 2000 | Kurt Waskow
Interested in information regarding PCB soldermask tenting over vias within a BGA layout. Is this a common practice to reduce the occurrence of shorts, are there any reliability concerns? Thanks!
Electronics Forum | Mon Feb 21 08:33:53 EST 2000 | Tony Di Mauro
Kurt, When I was working in a captive manufacturing house we had been to migrate toward tenting all vias under the BGA to eliminate not only shorts but insufficient (Starved) joints. Tony
Electronics Forum | Thu Apr 11 19:06:59 EDT 2002 | tmarc
We are using 1mm pitch BGAs with a great quantity of via(s) under the component. Very shortly we will be placing CSPs with .65mm pitch. Our via(s) are solder masked, however we generally have a percentage of them that the masking is thin enough that
