Electronics Forum | Thu Apr 11 19:06:59 EDT 2002 | tmarc
We are using 1mm pitch BGAs with a great quantity of via(s) under the component. Very shortly we will be placing CSPs with .65mm pitch. Our via(s) are solder masked, however we generally have a percentage of them that the masking is thin enough that
Electronics Forum | Thu Oct 28 15:53:27 EDT 2010 | dwonch
Ok, just to put closure on things I figured I should post the conclusion of this whole ordeal. We've acquired a new BGA rework station that allows us to get away without tenting our vias under the BGAs. This allowed us to change our PCB spec to rem
Electronics Forum | Sun Jan 09 19:37:15 EST 2005 | Bob R.
I'm just thinking out loud here with no experience to back it up, but I could see where you're trapping air or solvent filled voids inside the via by tenting from both sides. When you go through a heat cycle like reflow or wave solder you could be e
Electronics Forum | Tue Feb 19 11:08:22 EST 2002 | Chris Anglin
Guideline for Tenting Interstitial BGA Vias It is difficult to give a complete recommendation on via tenting without an idea what process conditions are required (ex: wave pass, double reflow, rework etc.). Via Pads (as Test Points) - On Bottom
Electronics Forum | Mon Oct 18 09:41:56 EDT 1999 | Wolfgang Busko
That should not happen. There are some threads concerning BGA and wavesoldering you could look for. It�s said that you should protect the vias in the BGA-area by soldermask or at least with tented vias to prevent rereflow of BGAs solderjoints what co
Electronics Forum | Fri Feb 22 14:22:07 EST 2008 | stevek
Are you using nocleans, especially when you get to SMT? Years ago, I had OA wave flux get into vias that were plugged from the top under parts. It is really difficult to clean small, high aspect ratio vias. Cross sections showed that the copper in
Electronics Forum | Wed Mar 23 22:28:10 EST 2005 | KEN
I ran into this yesterday. Seems some designer decided to not solder resist the via's on the solder side. Then the assembly went over the wave solder in a universal fixture. Not an ideal situation.
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Tue Sep 07 12:45:47 EDT 1999 | Brad Kendall
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Are you having a problem with the joint openning up after reflow. Like it was soldered after the reflow process, but at final test is not? I had this pr
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