Electronics Forum | Thu Sep 06 05:25:38 EDT 2018 | spoiltforchoice
I'm no expert but I think you will find the majority of discussions around BGA & good printing results focus on the PCB design and things like tented vias and pad definition. e.g https://macrofab.com/blog/bga-pad-creation-smd-nsmd/ After that, work
Electronics Forum | Tue Dec 14 22:17:33 EST 1999 | Dave F
Armin: How ya doin� bud? CK gives good advice, but I'd like to take a bit of a different angle. Q1. For 0.7 mm (0.027in) diameter hole for vias, what�s the minimum annular ring for this hole diameter? Depends on what you�re trying to do. For in
Electronics Forum | Fri Jan 21 16:50:33 EST 2005 | Board House
I work for a board house and our proceedure for this process is the following, We cover the via pads leaving the hole open and then apply the surface finish and then go back and Cover the Via with a second operation. By doing this you do not entrap
Electronics Forum | Tue Jun 15 22:31:06 EDT 2010 | Mag10
Depending on the how you plug the via, the void level can significantly affected. If you have via plugged from the bottom side; i.e. opposite side of the component, you will see alot of void due to entrapped air in the via hole. I found work best wh
Electronics Forum | Tue Mar 03 09:29:48 EST 2015 | rgduval
A couple of things that have helped me with solder ball issues at wave in the past: 1. Flux. Insure good flux coverage on the bottom of the board. 2. Preheat. Insure that the board is sufficiently preheated for the wave operation. Since you're
Electronics Forum | Tue Aug 22 14:52:55 EDT 2000 | John Thorup
Jax - absolutely right - the archives are a valuable tool and deserve to be used more than they seem to be. Caumel - Are your blobs on the solder side or the component side? Are your vias tented on the component side? What size are your vias? Is th
Electronics Forum | Mon Sep 28 09:35:28 EDT 1998 | Clive Heke
I have had some field failures returned recently, the boards had flux contamination under the components in a sensitive area, Nothing really visible until the component was removed, and the board had no evidence of rework of any type. Is it possib
Electronics Forum | Wed Sep 15 22:43:24 EDT 2004 | davef
Just to help convince those on the fence that we don't know dip: 2221A, 4.5.1 tells you the vias have to be tented on both sides.
Electronics Forum | Fri Dec 01 15:22:46 EST 2017 | kojotssss
Recommended land and solder pattern says: VIA wall plating, via holes should be tented with solder mask on the backside and filled with solder. Solutions at this moment ? Thanks for all :)
Electronics Forum | Wed Jun 10 15:10:55 EDT 1998 | Rich
I am looking for the Industry standards on vias. Are they required to be plated with solder or is copper plating enough? What about reliabilty with either one? Also, if tenting the via is required should it be copper plated or solder plated over c
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