New Equipment | Test Equipment
The TherMoiré® PS200S is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 150 mm x 200 mm. With time-temperature profiling cap
Acculogic introduces StatManager™ - an advanced test program coverage report generator with boundary scan fault inject capability. StatManager can calculate part and pin level coverage of Teradyne Spectrum and Teradyne Z18xx test programs. StatMana
Electronics Forum | Thu Aug 31 21:15:46 EDT 2000 | Dave F
From the SMTnet Library try: http://www.merix.com/resourcecntr/papers/osp.doc http://www.merix.com/resourcecntr/papers/hasl_alt.doc http://www.itm-smt.com/articles.html * "Organic Solderability Preservatives" * "OSPs - Better Living Through Modern Ch
Electronics Forum | Thu Aug 31 12:17:56 EDT 2000 | mike weekes
We are considering alternative Board Finishes to our existing HASL process. The HASL effects opens on 25 and 20 mil packages after reflow and we know if the advantages of CuOSP and other alternatives. OUR Concern: Is there a shelf life and handlin
Industry News | 2003-03-12 09:10:10.0
As part of the opening celebration, Teradyne will be exhibiting this week at SEMICON China and in April at Nepcon Shanghai.
Industry News | 2014-08-07 18:05:48.0
The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on September 9, 2014, from 9:30 am until 3:00 pm.
Technical Library | 2006-11-14 12:48:31.0
Content: 1. Bridge from Commercial Reliability 2. Existing PBGA use in Aerospace & Military 3. Drivers: Plastic versus Ceramic Package Weight 4. Attributes of PTFE and Thin Core FC Packages 5. Flip Chip Package Reliability 6. Flip Chip Package
Technical Library | 2012-12-14 14:17:56.0
This article provides practical and affordable Design-for- Test (DFT) and Design-for-Inspection (DFI) methods that will have a positive impact on product costs, yield, reliability, and time-to-market. The properties of testability (including controllability and observability) will be analysed as they relate to analogue and digital design rules and their cause/effect, as well as the electrical and physical characteristics of proper PCB design.
Career Center | Oakville, Ontario Canada | Engineering,Management,Production,Quality Control,Research and Development
Individuals who excel in this position enjoy working on the hardware-software boundary, are driven by complex problem solving in a fast paced environment. Candidate should be familiar with most of the electronic technologies and be able to work wit
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_teradyne_ict.html
Teradyne ICT Teradyne In-Circuit Tester Equipment Description Teradnye Model Number: Z1803 Plus-1 Serial Number: 1888-1-123 (20) 051-027-00 DR2 (11) 051-085-00 (1) 047-081-01 Deltascan2
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/043018-contact-versus-non-contact-dispensing
Contact versus Non-Contact Dispensing (Jetting) Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
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