Industry News | 2010-10-08 01:29:11.0
Teradyne, Inc. (NYSE: TER) announced that Realtek has selected the J750Ex for wafer sort and final test of their devices.
Industry News | 2015-04-03 16:01:12.0
United Test and Assembly Center, Ltd. (UTAC) selected the J750EX-HD and placed a multi-system order.
Career Center | , | Engineering
We're looking for a seasoned Electronics Manufacturing Executive to lead a team of both ICT and Functional Test Engineers as a Test Engineering Manager in the Midwest, and we're also looking for a Sr. Test Development Engineer in New England. Both po
Industry News | 2011-07-14 10:30:38.0
Teradyne announces the availability of the UltraPAC80, UltraPin1600, UltraSerial10G and UltraVI80 instruments for the UltraFLEX® test system. These instruments increase the system's scalability and offer customers solutions to lower cost of test and improve time to market. New features also enable the testing of emerging SOC technology, including higher external data rates and new packaging technologies such as 3D System-In-Package.
Intrinsic Quality is pleased to offer a variety of Test Fixture Development Services that include fixture building, tester interface building, harness building, troubleshooting, maintenance, design, and engineering. IQ’s fixtures are built to exactin
Industry News | 2015-04-03 15:57:56.0
Q4'14 Revenue of $323 million, up 13% year over year and full year revenue up 15% Quarterly cash dividend of $0.06 and $500 million share repurchase program announced
Career Center | Owings Mills, Maryland USA | Engineering,Production
In this role with TTCI you will specialize in the development of In-Circuit Test (ICT) sets for Agilent 3070 (Formerly HP) and/or Teradyne (Formerly GenRad) TestStation/228X test systems. Candidates should have at least 7 years experience with in-c
Automates the PCB's ICT process using a unversal board handler that fits a GenRad, Teradyne or Agilent ATE tester. Result has been the elimination of false failures, greater test accuracy, less rework, and better throughput.
Industry News | 2015-04-03 16:01:42.0
Sixth Generation RF Solution Focuses on Emerging LTE-Advanced and 802.11ac Challenges
Technical Library | 2013-08-07 21:52:15.0
PCB architectures have continued their steep trend toward greater complexities and higher component densities. For quality control managers and test technicians, the consequence is significant. Their ability to electrically test these products is compounded with each new generation. Probe access to high density boards loaded with micro BGAs using a conventional in-circuit (bed-of-nails) test system is greatly reduced. The challenges and complexity of creating a comprehensive functional test program have all but assured that functional test will not fill the widening gap. This explains why sales of automated-optical and automated X-ray inspection (AOI and AXI) equipment have dramatically risen...
