Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
Technical Library | 2020-09-02 14:34:23.0
Atomic layer deposition (ALD) is a process of creating coatings on a molecular layer by layer basis. Using an iterated sequence of self-saturating deposition cycles that are self-terminating, a single layer can be deposited at a time, allowing for highly uniform films with complete conformality. The composition of the film typically used for coating printed wiring boards (PWBs) is a high alumina (Al2O3) sequential deposition of alumina and titania capped with a corrosion protective titanium aluminate layer, most notably ALD-Cap from Sundew Technologies, LLC. Rework is a process of restoring an electronics assembly to full functionality to prolong equipment life and reduce the amount of scrap. The process typically involves:
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