New Equipment | Test Equipment
Tebo-ICT is a kind of very professional ICT and ATE fixture software. Chinese interface, designed in humanity, compatible with Win98/2000/NT/XP/7/10 system, which is easy to operate and train. It can cope with all kinds of GERBER and buried via, posi
New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
Electronics Forum | davef |
Wed Jun 22 11:03:30 EDT 2005
Electronics Forum | Thu Oct 07 03:19:33 EDT 1999 | Chris May
| Our first article inspection after machine placement can take several hours depending on the complexity of the board. The operator visually checks the board against the drawing and bill of material. I'd be interested to hear if there are any other
Industry News | 2005-09-15 12:19:34.0
More than 100 companies, government enterprises and educational institutions contributing to public release of �revolutionary� laser-based building surveying and facilities management solution
Industry News | 2005-12-13 18:58:01.0
ENR Top 500 National Design Firm Uses PowerCAD� SiteMaster� 2 �Point-Shoot-Done� Laser-Based Mobile Field Solution To Finish 2.1 Million Square Foot US Navy Building Surveying Project More Than 30 Days Ahead Of Schedule
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Parts & Supplies | Pick and Place/Feeders
Supply&repair juki spare parts at l lower price: JUKI 710(720) CARRY UNIT E86127150B0 JUKI 710(720) CPU CARD E8601715AA0 JUKI 730(740) CARRY BOARD E86067210A0 JUKI 730(740) DC SERVO DRIVER E86037210A0 JUKI 750(760) AC SERVO CARD E86027210A0
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Parts & Supplies | Pick and Place/Feeders
Supply&repair juki spare parts at l lower price: JUKI 710(720) CARRY UNIT E86127150B0 JUKI 710(720) CPU CARD E8601715AA0 JUKI 730(740) CARRY BOARD E86067210A0 JUKI 730(740) DC SERVO DRIVER E86037210A0 JUKI 750(760) AC SERVO CARD E86027210A0
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
Career Center | Exton, Pennsylvania USA | Engineering,Maintenance
Innovative Solutions and Support is an industry leader in supplying analog and digital instrumentation to the military, commercial and business sectors within the aviation marketplace. We provide technological solutions to some of the most substantia
Career Center | Oldsmar, Florida USA | Engineering,Production,Quality Control
Provide manufacturing engineering support to the build of circuit card assemblies as a contributing member of an integrated product team (IPT). Provide day-to-day support to manufacturing operations to ensure quality, cost and schedule goals are
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
Career Center | Toronto, Ontario Canada | Engineering,Production,Purchasing,Sales/Marketing
A dedicated professional with 17+ years of experience in product management, marketing, project management, engineering and manufacturing. Demonstrated ability to interact with customers and manage cross-functional teams to drive business growth. 4+
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1375&OB=DESC.html
. A large number of customers provided gerber data in imperial (2.3 or 2.4 inch format) and excellon drill data in metric ( 3.3 mm format) together with a drawing from a mechanical cad system that used metric
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/technical-experts/micro-testing-thin-die
. Please see the below drawing: Typical test results: Die thickness Typical destructive force 30 um 48 to 70 grams 40 um 90 to 130 grams Summary With the advent of new materials, technology and advanced packaging trends
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