Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: 4+ years experience and expertise in functional test development of RF wireless products. Provide DFT on circuit card assemblies. Duties/Functions: Design, analyze,build, implement and support test programs, test fixtures and equ
Used SMT Equipment | In-Circuit Testers
Anritsu MT8852B-40 Bluetooth Test Set with no EDR and no Audio Bluetooth Test Set with no EDR and no Audio Anritsu understands the requirements of the manufacturers of Bluetooth modules. Test times must be minimized yet performance must be as
Career Center | Silicon Valley area, California USA | Sales/Marketing
Circuit Check, Inc. is the industry leader in the design and manufacture of Automatic Test Equipment (ATE) Test Fixtures for In-circuit, functional, and test programming, is seeking a Business Development Sales Representative based in the San Francis
Used SMT Equipment | In-Circuit Testers
Multiport Test Set (8 port) The Agilent Z5623A Option H08 Multiport Test Set is designed for use with 50 Ohm Network Analyzers such as the Agilent PNA Series (Models E8356A, E8357A, and E8358A). The Z5623A Option H08 is an external eight port tes
New Equipment | Test Equipment
iCT7000™ is ideal for electronics assembly manufacturers that require high throughput, test accuracy and proven reliability at lower test costs. The InCircuit Scorpion is a small footprint in-circuit tester that can be configured with up to 2048 all-
Used SMT Equipment | In-Circuit Testers
The Agilent Z5623A Option H08 Multiport Test Set is designed for use with 50 Ohm Network Analyzers such as the Agilent PNA Series (Models E8356A, E8357A, and E8358A). The Z5623A Option H08 is an external eight port test set with mechanical switchin
Industry News | 2013-10-11 17:34:05.0
Everett Charles Technologies’ (ECT) today announced that it will exhibit in Stand A1-567 at the 20th international Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Layer: 10L Base Material:FR-4 tg180(ITEQ) Board Thickness: 1.6mm Final copper: 35um Surface Finish:Immersion Gold/Au:2u” min. Gold fingers/Au:30u” Solder mask: Green Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Fi
Specification: 6L Material: FR-4 TG170 Board thickness: 1.6mm Final copper: 35um Solder mask color: Blue Surface Finish: Immersion Gold, Au:3u” min. Impedance control Profile: Routing E-test: 100% Fixture Quality report: Solderability
Layer: 1L Base Material:CEM-1 CTI600 Board Thickness: 1.6mm Final copper: 35um Surface Finish: HAL lead free Solder mask: Matt Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test,
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