Nano Tribometer In Nanotribometry, a flat, a pin or a sphere is loaded onto the test sample with a precisely known force.The friction coefficient is determined during the test by measuring the deflection force on the arm. Wear coefficients for the
Used SMT Equipment | In-Circuit Testers
The FIREBERD 6000 is known for its excellence in physical layer testing, but TTC (now Acterna) is also committed to providing superior test solutions for new technologies, such as frame relay and asynchronous transfer mode (ATM). In fact, using modul
Industry News | 2012-11-06 15:19:48.0
Mentor Graphics announced its new Tessent® IJTAG solution, which allows designers to easily reuse test, monitoring and debugging logic embedded in existing IP blocks. Supporting the IEEE P1687 (IJTAG) standard, the solution automatically retargets test and debug commands and generates an integrated hierarchical control and data network with a single top-level interface for an entire SoC.
Industry News | 2017-09-08 11:42:57.0
Compact models have a built-in true spectrum analyzer, dual channel 25MHz AWG, DMM, and a power supply to suit educational and restricted space situations
New Equipment | Test Equipment
Teradyne’s Spectrum™ 8862 (TSSE) is a unique combinational in-circuit (ICT)/ functional test system that can lower overall costs and test times for manufacturers that prefer to combine functional and ICT test capabilities on a single system. Spectrum
Used SMT Equipment | In-Circuit Testers
Rohde & Schwarz CMW500 loaded with options Wideband Radio Communication Tester Rohde & Schwarz CMW500 LTE FDD CDMA2000 1XEV-DO with the following configuration: CMW500 Hardware Options Included: H051F/H052F/H054B/H055H/H090A/H100A/H110A/H200
Used SMT Equipment | In-Circuit Testers
Rohde & Schwarz CMW500 loaded with options Wideband Radio Communication Tester Rohde & Schwarz CMW500 LTE FDD CDMA2000 1XEV-DO with the following configuration: CMW500 Hardware Options Included: H051F/H052F/H054B/H055H/H090A/H100A/H110A/H200
Technical Library | 2007-05-09 18:26:16.0
High Density Interconnect (HDI) technology is fast becoming the enabling technology for the next generation of small portable electronic communication devices. These methods employ many different dielectrics and via fabrication technologies. In this research, the effect of the proximity of microvias to Plated Through Holes (PTHs) and its effect on the reliability of the microvias was extensively evaluated. The reliability of microvia interconnect structures was evaluated using Liquid-To-Liquid Thermal Shock (LLTS) testing (-55oC to +125oC). Comprehensive failure analysis was performed on microvias fabricated using different via fabrication technologies.
Industry News | 2002-05-16 16:53:54.0
New Family of 12 Automated Accelerated Reliability Test Systems (AARTS) Starting at $99K
Industry News | 2017-01-10 15:13:27.0
Acculogic announces that it will exhibit in Booth #909 at the 2017 IPC APEX EXPO, scheduled to take Feb. 14-16, 2017 at the San Diego Convention Center in Calif. Company representatives will demonstrate the FLS980 Series III, Scorpion Briz Test & Programming station, and comprehensive line of Boundary Scan Test tools. Additionally, Acculogic will introduce High Volume Inline solutions as well as End of Line Functional test.
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