Technical Library | 2024-04-08 15:46:36.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Industry News | 2013-11-08 11:15:49.0
AOI can be a powerful tool when effective quality management becomes an absolute priority. Below, Andy Bonner, Managing Director at Cupio Yestech Europe demonstrates this with a look at BEKA associates, who are using AOI within their manufacturing operation producing display instruments certified for safe use within potentially hazardous areas..
Industry News | 2023-09-13 14:54:41.0
Naprotek, LLC. today announced the strategic addition of Seica's Pilot V8 Next Flying Probe to their state-of-the-art manufacturing facility.
http://www.quickshotxrf.com Quickshot XRF Sales Representative gives a brief overview of the Handheld X-ray Fluorescence technology. Visit the QSX website for details on the system, which provides a testing solution for hazardous substance detection
Commonly referred to "Cleanliness Testing" as this test method has, for over 40 years, been acknowledged as an important Quality Assurance and Process Control tool in the manufacture of electronic circuit boards, components and assemblies. The Conta
Used SMT Equipment | General Purpose Test & Measurement
JDSU OLP-55 JDSU OLP55 POWER METER -70 TO +20 DBM 780-1650NM JDSU OLP-55 Smart Optical Power Meter is designed for installing, testing, and maintaining singlemode and multimode networks and cables. The SMART Optical Power Meter defines a new in
Industry Directory | Manufacturer
We're an electronics manufacturing services (EMS) provider based in the UK and Czech Republic delivering reliable and cost-effective electronics assembly, including pcb assembly and test, in addition to electro-mechanical assembly
Industry Directory | Manufacturer's Representative
X-ray Fluorescence (XRF) analyzers developed for RoHS testing, solder composition, etc. Handheld XRF and Desktop systems are available; rental options as well.
Industry News | 2010-03-24 22:00:27.0
WOBURN, MA - Acculogic's Manufacturing Test Systems Division, a global leader in electronics test and production solutions, announces that it will feature the latest testing technologies booth 249 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry Directory | Distributor
You've got problems? We've got parts!! We help keep production lines up and running & take the stress out of procurement. SolTec offers strategic procurement solutions for your supply chain.
