Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Equipment Dealer / Broker / Auctions
A dealer of high quality Used SMT Equipment, Used Plastic Injection Molding Equipment, Used Machine Tools, Used Semiconductor Machinery, and Used Industrial Machinery.
New Equipment | Assembly Services
As leading one-stop PCB Assembly services provider in China, Hitech Group offers high quality, cost effective, express PCB board products and provides PCB manufacturing, electronics assembly manufacturing, components sourcing, Box build assembly and
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Electronics Forum | Wed Feb 16 17:28:14 EST 2005 | davef
Greg: As we understand it, in your situation: * One 0805 lead solders to board properly * Another 0805 lead does not solder On the 0805 lead does not solder, there does the solder go? * On the pad * On the component lead A common solderability test
Electronics Forum | Thu Feb 17 12:04:52 EST 2005 | Indy
Have you tried doing solder dip test on these components? Or a Leaching Test, to see if the solder catches on the termination ? I suggest you should try these tests.. Cheers Indy
Used SMT Equipment | Soldering - Wave
400V 50/60 HZ Version ERSAsoft for: 4.050.000.000 2. Operating System Dell / Windows 7 Processor: Pentium(R) Dual Core E5800 @ 3.20GHz 3.19GHz Memory RAM: 4.00 GB (3.46 GB usable) 320bit Operating System Touch Screen – No Pen Touch, input is availabl
Used SMT Equipment | SMT Equipment
Product Name: Samsung CP45FV-NEO multi-function chip mounter Product number: CP45FV-NEO Detailed product introduction Samsung CP45FV-NEO multi-function chip mounter Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max sp
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Industry News | 2013-09-10 17:48:54.0
We are happy to announce that we have opened a new Class 10K cleanroom in the NJ facility.
Parts & Supplies | Chipshooters / Chip Mounters
YAMAHA Original SMT Spare Part Motor P50b07030dxs4e Model NO.: P50B07030DXS4E Type: High-speed Chip Mounter Part No: P50b07030dxs4e Quality: 100% Tested Lead Time: 3 Days Trademark: YAMAHA Transport Package: Carton or as Your Requirements Specifica
Parts & Supplies | Chipshooters / Chip Mounters
YAMAHA SMT Spare Parts Motor P50b05020xs4e Model NO.: P50B05020XS4E Type: High-speed Chip Mounter Part No: P50b05020xs4e Quality: 100% Tested Lead Time: 3 Days Trademark: YAMAHA Transport Package: Carton or as Your Requirements Specification: 3kg O
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-08-16 18:42:25.0
In one of our medical applications projects, the customer wanted to dispense a mask to protect gold leads and an underfill on a silicon substrate with a clear test die. The substrates were Dymax X-499-91-C for Masking and Epoxibond-106M-1 for Underfill Dispensing
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Thu Jun 14 00:00:00 EDT 2018 - Fri Jun 15 00:00:00 EDT 2018 | ,
SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Career Center | Fremont, California USA | Engineering
Ensure manufacturing have calibration and preventive maintenance processes in place to ensure the integrity of test equipment used on our products. Lead and responsible for all aspects of the RMA/GRS processes from initial analysis, board debug t
Career Center | , California USA | Engineering
www.srqconsultants.com : for all Job Reqs This Lead Analog IC Test Development Engineer position will require senior level ability on at least one of the following machines: Teradyne: Catalyst, A5XX, J750, Tiger Agilent 84000, 94000 Credence Duo, Q
Career Center | vestal, New York USA | Quality Control
Over 7 years of experience as lead quality engineer in the filed of SMT. Extensive knowledge on Universal GSM,GC60 and GC120 Machines. worked on IBM Rational and Mercury Winruner testing tools.
Career Center | Appleton, Wisconsin USA | Engineering,Production,Research and Development,Technical Support
I have more than 25 years of experience in electronics manufacturing and printed circuit board (PCB) structural test. My forte is in-circuit test (ICT) program and fixture development and debug on the HP/Agilent 3070. I have more than 16 years of 3
Defect Coverage for Non-Intrusive Board Tests Defect Coverage for Non-Intrusive Board Tests Non-intrusive board test (NBT) is an emerging test methodology that integrates several complementary embedded-instrumentation-based test technologies
SMTnet Express, May 5, 2022, Subscribers: 25,613, Companies: 11,567, Users: 27,202 Electronics Manufacturing Technical Articles Rapid Deployment of Automated Test-System for High-Volume Automotive USB-C Hub Adoption and integration
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/torsion-test
Contact Global HQ Africa Asia Central and South America Europe USA and Canada Nordson DAGE Home Test Types Torsion test Torsion test Torsion testing can be used to bend and twist component leads
| https://www.eptac.com/faqs/ask-helena-leo/ask/shelf-life-of-soldered-components
. 1.1 Scope This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires
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