2001 test pad results

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SIPAD Systems Inc.

The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.

PCB Design Optimization of 0201 Packages for Assembly Processes

Technical Library | 2023-05-02 19:03:34.0

The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified.

Flextronics International

PADS Testimonials

Videos

See what some of our customers have to say about the complete PCB design environment offered by PADS 9.0. This next generation in PCB Design tool combines an intuitive, flexible design environment with integrated, scalable technology. Giving engine

Mentor Graphics

Solder Joint Reliability Under Realistic Service Conditions

Technical Library | 2014-10-30 01:48:43.0

The ultimate life of a microelectronics component is often limited by failure of a solder joint due to crack growth through the laminate under a contact pad (cratering), through the intermetallic bond to the pad, or through the solder itself. Whatever the failure mode proper assessments or even relative comparisons of life in service are not possible based on accelerated testing with fixed amplitudes, or random vibration testing, alone. Effects of thermal cycling enhanced precipitate coarsening on the deformation properties can be accounted for by microstructurally adaptive constitutive relations, but separate effects on the rate of recrystallization lead to a break-down in common damage accumulation laws such as Miner's rule. Isothermal cycling of individual solder joints revealed additional effects of amplitude variations on the deformation properties that cannot currently be accounted for directly. We propose a practical modification to Miner's rule for solder failure to circumvent this problem. Testing of individual solder pads, eliminating effects of the solder properties, still showed variations in cycling amplitude to systematically reduce subsequent acceleration factors for solder pad cratering. General trends, anticipated consequences and remaining research needs are discussed

Universal Instruments Corporation

Megger DET2/2

Used SMT Equipment | General Purpose Test & Measurement

Megger DET2/2 Digital High Sensitivity Ground Resistance Tester Megger DET2/2 (250202) Auto Earth Tester is a robust compact instrument designed for measuring earth electrode resistance and soil resistivity. It uses the four terminal method of

Test Equipment Connection

Acculogic Scorpion FLS980Dxi Flying Probe Test Platform

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“The Ultimate Probing Machine”. Ultra Fast full Function Patented Double-sided, Closed Loop 22-probe System, All probes are Analog, Digital, Boundary Scan, and Vectorless Test enabled. Use it In-Line or manual operation with AOI capabilities. The

Southwest Systems Technology