Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
.png)
Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer
Lewis and Clark is your #1 Pre-Owned Surface Mount and In-Circuit Test equipment supplier. We offer a variety of equipment solutions at a significant cost savings over new.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
New Equipment | Education/Training
This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac
Electronics Forum | Tue Feb 03 19:56:43 UTC 2026 | SMTA-81449947
Hello all, I have a PCB I want to run through wave solder with test points(keep out areas) really close to the solder joints. When designing a wave solder pallet, what is the minimum keep out distance from the pallet opening to the desired solder joi
Used SMT Equipment | In-Circuit Testers
Make: Digital Test Model: MTS-505 Condor II Vintage: 2016 Additional Photos: https://www.dropbox.com/home/Sierra/DigtalTest%20FP Condition: Complete & Operational Location: USA Availability: 05-31-21
Used SMT Equipment | X-Ray Inspection
Test Research TRI, TR 7006L 3D Solder Paste Inspection, Located In Fremont, CA An auction item: bidding on this listing starts on Wednesday, September 20, 2017 6:00:00 AM
Industry News | 2013-09-10 17:48:54.0
We are happy to announce that we have opened a new Class 10K cleanroom in the NJ facility.
Industry News | 2023-03-30 22:45:02.0
Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of reflow and curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region.
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Training Courses | ON DEMAND | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Events Calendar | Tue May 11 18:30:00 UTC 2021 - Tue May 11 18:30:00 UTC 2021 | ,
Europe Chapter Webinar: Testing Coatings of Electronic Assemblies - Reliability is No Coincidence
Events Calendar | Wed Aug 14 18:30:00 UTC 2024 - Wed Aug 14 18:30:00 UTC 2024 | Duluth, Georgia USA
Atlanta Chapter In-Person Technical Meeting: State-of-the-Art Test Techniques
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Rolling Meadows, Illinois USA | Production
Family-oriented specialized PCB test, rework and repair facility seeks several highly skilled technicians. If you are highly skilled then come work with among the best soldering and PCB test and repair technicians in the US. Relevant Work Experience
Career Center | Sta Rosa, Laguna Philippines | Maintenance
In-Circuit Test and Functional Test Fixture and Jigs local fabricator, and customers support on all ICT related issues with main Office in Japan. � Perform debugging of In-Circuit test programs and fixtures for GenRad228x/Teradyne Test system, GenRa
Career Center | Valrico, Florida USA | Engineering,Production
Due to an excellent career opportunity for my wife, I will be relocating to the Atlanta area soon. I am looking to continue my career as a Test Engineer in the electronic manufacturing field. I have moved up quickly with my current employer and I
| https://unisoft-cim.com/customer.php
) Electronic Resources Corporation* Electronics Integration Technology (EIT) Incorporated* Eletronic Teste Produtos Representacoes Ltda. – Brasil* Elgin Electronics* Elmgrove Technologies
