New SMT Equipment: tests to confirmed a good solder joint (1)

IR-E6 Evolution BGA Rework Station for PCB's up to 24

IR-E6 Evolution BGA Rework Station for PCB's up to 24

New Equipment | Rework & Repair Equipment

Ultimate Performance, BGA Rework Station for small-large PCBs up to 24"/620mm The PDR E6 XL BGA Rework Station is made of only the finest materials and components for optimum precision and rework excellence. PDR's E6 SMD Rework Station is PDR's larg

PDR-America

Electronics Forum: tests to confirmed a good solder joint (39)

How to choose a new solder paste

Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef

Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly

How to improve the solder quality of QFN?

Electronics Forum | Fri Jul 08 16:35:04 EDT 2005 | Jason Fullerton

"Whether or not you need a toe fillet depends on your application. We have high reliability products where we can't use a QFN over a certain size, regardless of toe fillet. We have other applications where we meet the thermal cycle requirements for a

Industry News: tests to confirmed a good solder joint (27)

SMTA China to Sponsor SMT Engineer Certification Program

Industry News | 2008-03-12 16:17:32.0

SMTA China announces that it will sponsor the upcoming SMTA Certified SMT Engineering Course and Examination from 8-10 April 2008 in Shanghai in conjunction with NEPCON China 2008. SMTA China and ChinaECNet will jointly organize the first course with support by NEPCON China 2007.

Surface Mount Technology Association (SMTA)

IPC and JEDEC Help Industry Transition to Lead Free Associations Host Conference on Transitioning to Lead Free � Strategies for Implementation

Industry News | 2009-02-21 17:56:00.0

BANNOCKBURN, Ill. and ARLINGTON, Va., USA, February 19, 2009 � IPC � Meeting the requirements of RoHS (restriction of the use of certain hazardous substances in electrical and electronic equipment) compliance and successfully implementing lead-free electronics assembly processes is an ongoing challenge for the electronic interconnect industry. To help companies work toward their compliance goals, IPC and JEDEC present �Transitioning to Lead Free � Strategies for Implementation,� a three-day conference to be held March 3�5, 2009 in Santa Clara, Calif.

Association Connecting Electronics Industries (IPC)

Technical Library: tests to confirmed a good solder joint (1)

Using Automated 3D X-Ray Inspection to Detect BTC Defects

Technical Library | 2013-07-25 14:02:15.0

Bottom-termination components (BTC), such as QFNs, are becoming more common in PCB assemblies. These components are characterized by hidden solder joints. How are defects on hidden DFN joints detected? Certainly, insufficient solder joints on BTCs cannot be detected by manual visual inspection. Nor can this type of defect be detected by automated optical inspection; the joint is hidden by the component body. Defects such as insufficients are often referred to as "marginal" defects because there is likely enough solder present to make contact between the termination on the bottom-side of the component and the board pad for the component to pass in-circuit and functional test. Should the board be subjected to shock or vibration, however, there is a good chance this solder connection will fracture, leading to an open connection.

Flex (Flextronics International)

Express Newsletter: tests to confirmed a good solder joint (1143)

SMT Express, Issue No. 3 - from SMTnet.com

SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Front Page Book Review by Brian Ellis Title: A Comprehensive Guide to the Design and Manufacture of Printed Board

Partner Websites: tests to confirmed a good solder joint (82)


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