Industry Directory | Manufacturer
Our services include: design/layout, fabrication of bare printed circuit boards, contract manufacturing assembly, sheet metal work, precision machining, and electromechanical assembly.
Industry Directory | Consultant / Service Provider / Distributor / Manufacturer / Other
Ludee Circuits offer RoHS PCB.We could offer leadfree HASL,Entek, flash gold, immersion gold, immersion silver, immersion tin finishing based on standard FR-4, CEM-3 materials, Teflon, Rogers RO4000 series, as well as high Tg S1170 materials.
New Equipment | Fabrication Services
Quantity: 5pcs Lead Time: 7 working days Number of layers: 2 layers Max board dimensions: 6300x3900mils/160x100mm Material: R-4, Tg130 Finished Thickness: 63mil/1.6mm Min Trace/space: 6mil/0.15 Min.Holes size: 12mil/0.3mm Copp
New Equipment | Fabrication Services
Quantity: 5pcs Lead Time: 7 working days Number of layers: 4 layers Max board dimensions: 6300x3900mils/160x100mm Material: R-4, Tg130 Finished Thickness: 63mil/1.6mm Min Trace/space: 6mil/0.15mm Min.Holes size: 12mil/0.3mm Co
Electronics Forum | Mon Nov 13 09:22:10 EST 2006 | aj
Hi all, Should we need to order the Higher TG to run boards safely thru a RoHS Process (reflow only)? We had an issue with the previous batch delaminating and were advised by supplier that we should have stated the higher TG rating even though the p
Electronics Forum | Thu Sep 09 19:32:12 EDT 2021 | kumarb
Forgot to ask earlier - what is the TG rating for your laminate? If not selected already, use a high TG rating like TG155 or TG170 laminates for the ROHS temps. Never saw swollen PCBAs with such rated PCBs to date.
Industry News | 2015-03-16 11:44:31.0
PNC is proud to announce the latest add-on qualification of product testing to Military Performance Specification MIL-PRF-31032, CAGE Code 66766.
Technical Library | 2019-12-30 02:11:05.0
(ROHS, Halogen Free & Reach Compliance) FR-4 (Tg130-180): ShengYi, ITEQ, KB, Huazheng High Speed FR4, Ceramics & Telflon, Rogers
Technical Library | 2016-11-17 14:58:02.0
Since 2006 RoHS requirements have required lead free solders to take the place of tin-lead solders in electronics. The problem is that in some environments the lead free solders are less reliable than the older tin-lead solders. One of the ways to solve this problem is to corner stake, edge bond or underfill the components. When considering what mitigation technique and material to use, the operating conditions must be characterized. The temperature range is important when selecting a material to use since the glass transition temperature (Tg) and coefficient of thermal expansion (CTE) are important properties. If improperly chosen, the mitigation material can cause more failures than an unmitigated component.
SMTnet Express, November 17, 2016, Subscribers: 26,573, Companies: 15,019, Users: 41,420 How Mitigation Techniques Affect Reliability Results for BGAs Greg Caswell, Melissa Keener; DfR Solutions Since 2006 RoHS requirements have required lead free
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/events/smta-michigan-expo-and-tech-forum-2016
. For example, RoHS requirements have driven printed circuit board assembly materials to ever higher temperature capabilities. The High Tg materials are designed to withstand the higher reflow temperatures of lead free solders but present their own set of problems down the line in subsequent manufacturing steps
