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AIM to Debut NC259 Solder Paste at the 2012 IPC APEX Expo

Industry News | 2012-01-20 15:08:03.0

AIM will debut its new NC259 Solder Paste chemistry in Booth #2804 at the upcoming IPC APEX Expo.

AIM Solder

AIM’s Regional Technical Support Manager to Discuss Lead-Free Alloy Development at the SMTA China South Conference

Industry News | 2012-08-01 16:22:42.0

AIMannounces that Luke Chen will present at the upcoming SMTA China South Conference

AIM Solder

China Becomes the Hot Spot for Global Electronics Manufacturing Giants

Industry News | 2012-03-24 10:06:28.0

NEPCON China Becomes a Platform for the Debut of New Product Releases in Asia

Nepcon Electronics

AIM to Showcase NC259 Solder Paste at the 2013 Del Mar Show

Industry News | 2013-04-01 09:02:49.0

AIM Solder today announced that it will highlight its new NC259 Solder Paste in Booth #554-556 at the Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA

AIM Solder

Akrometrix to Participate in the SMTAI Spotlight 5 Panel Discussion: “Warpage Induced Defects and Component Warpage Limits”

Industry News | 2017-08-30 16:58:11.0

Akrometrix will be a panelist in the upcoming SMTAI Spotlight 5 panel discussion, scheduled to take place Wednesday, Sept. 10, 2017 from 2-3 p.m. The discussion, entitled “Warpage Induced Defects and Component Warpage Limits,” will be streamed on Facebook Live.

Akrometrix

Datest Announces Quick-Turn Troubleshooting Service with the Installation of Its XD7600NT500 Ruby X-ray Inspection System from Nordson DAGE

Industry News | 2012-05-17 13:22:21.0

Datest,has successfully installed a XD7600NT500 Ruby X-ray Inspection System with X-Plane™ technology from Nordson DAGE.

Datest

MatriX Technologies introduces its high-speed inline 3D X-ray inspection system at the APEX show 2013 in San Diego

Industry News | 2013-03-12 14:11:50.0

After successfully launching the first X3 In-line X-Ray system in 2011, MatriX Technologies now presented its new X3L system in the USA. As of this year, besides the universal 3D inspection system X3, the X3L configuration is available with an innovative dual detector concept, combining a line-scan for transmission inspection of complete PCBs in a few seconds and a high-resolution digital flatpanel detector for selective 3D image capturing.

MatriX Technologies GmbH

AIM’s International Technical Support Manager, Carlos Tafoya, to present at the IPC Conference on Solder and Reliability in Costa Mesa, CA, November 13, 2013

Industry News | 2013-11-08 18:26:23.0

AIM Solder announces today that Carlos Tafoya, International Technical Application Manager, is to present "Alternative Lead-Free Alloys for SMT Assembly" at the IPC Conference on Solder and Reliability: Materials, Processes and Tests, held November 13-14th, 2013 in Costa Mesa, CA. The presentation is scheduled on Wednesday, November 13 at 3:00 pm.

AIM Solder

BGA drop off from the boards

Electronics Forum | Fri May 23 11:14:15 EDT 2014 | rboguski

Agree with previous comment regarding possible head-in-pillow. Use 3D x-ray or CT-scan to verify.

Sm t t net
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