SMTnet Express, April 22, 2021, Subscribers: 27,222, Companies: 11,340, Users: 26,602 Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components Voids affect the thermal characteristics and mechanical properties of a solder
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. Even relatively average boards have thousands of soldered joints, and these are where the majority of problems are found. This increase in the complexity of boards also means that manual inspection is not a viable option these days
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. But when I came across this quote on a recent overseas flight, it struck me that Drucker could just as easily have been talking about the lead-free issue in our industry, particularly in the United States
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