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Need help on selecting the SMT equipment for small volume

Electronics Forum | Thu Jul 21 12:15:22 EDT 2005 | fastek

No need to punish yourself Rob.....you are 100% correct on all points.

Need help on selecting the SMT equipment for small volume

Electronics Forum | Tue Aug 23 04:04:58 EDT 2005 | Rob

But one of the unique selling points of a Fuji has always been all that space you get to hide things in when the auditors come round.....

Component Drop on Second side of the reflow

Electronics Forum | Mon Aug 14 04:00:25 EDT 2017 | sankarseptember

We check the TDK data sheet reflow profile condition. We check the PCB surface temperature the max temperature is 237.Anyhow We will confirm it by check temperature on TDK point

ionic residues on the surface of printed circuit assemblies

Electronics Forum | Wed Sep 02 16:41:44 EDT 2009 | pcbcleaning

Advanced Cleaning Solutions is a Johnstown, PA based electronic manufacturing service provider (EMS) with more than 3,500 square feet of ESD safe facilities. Our services include precision PCB cleaning and ionic cleanliness testing/verification usin

ionic residues on the surface of printed circuit assemblies

Electronics Forum | Wed Sep 02 21:57:17 EDT 2009 | davef

contacts for cleaning contractors are: * Petroferm Contract Services [www.partscleaned.com] Franklin, Ky * Aqueous Technologies [www.aqueoustech.com] Rancho Cucamonga, CA * FinePoint Precision Cleaning [www.finepointinc.com] Kokomo, IN * Austin A

Need help on selecting the SMT equipment for small volume

Electronics Forum | Thu Aug 04 17:42:45 EDT 2005 | Neel

Rob is right on with the comments above. As I believe it is pointed out, check out Mydata and also Assembleon. In fact, in helping others like you I have found Assembleon to strike the better deal even over Mydata. You can teach parts and boards wit

Component Drop on Second side of the reflow

Electronics Forum | Sat Aug 12 11:55:52 EDT 2017 | sankarseptember

We are facing component Drop on second side of the reflow.We are using Senju Reflow oven..Profile judgement was within in the standard.All the component Drop occur in between last heating zone and cooling Zone.The dropped component is ICC 525FL5 SOP

Re: My 2cents on the new forum layout

Electronics Forum | Tue Mar 10 16:11:16 EST 1998 | Mike

| Hello, | I know nobody asked, but here are my 2cents on the newer, more comercialized layout of the forum. | I frequent many of the SMT/Assembly forums and the ones I prefer to stay with are the ones that are NOT comercially oriented. | Not having

component aherence force on the solder paste before reflow

Electronics Forum | Mon Jul 02 20:13:41 EDT 2001 | davef

We agree with Wolfgang. Adding points along his line of reasoning: * Also consider placed component prescience. Sometimes, a mis-pick results in paste on the nozzle, which leads to the next component being stuck on the nozzle and not placed, which

Looks like we'll be BGAing in the near future

Electronics Forum | Wed Feb 06 16:05:24 EST 2008 | dphilbrick

At one point in time we were putting TI NanoStar parts on these particular boards. You don't want to attempt this at home! Thank God they took them off. Part was 1.45 X 1mm with 6 .1mm balls. They were a pain in the A$$. We had about a 90% success ra


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