Electronics Forum | Fri Apr 09 08:58:28 EDT 1999 | Justin Medernach
| I'm not sure about limits but perhaps underfilling the BGA might easy your mind. Treat the BGA as something similar to a flip chip and dispense underfill around the part. The rigidity gained by the cured underfill may be enough to alleviate some
Electronics Forum | Tue Feb 03 10:10:27 EST 2009 | milroy
Hi, There is one thing missing still, you must put a TC from the bottom side of the BGA by making a hold on the test board at the TC can measure the temperature at exactly the middle of the BGA. You should be able to the dual time and peak temperatu
Electronics Forum | Mon May 12 12:58:07 EDT 2014 | emeto
Hello all, I have a diode(gold plated)on some assemblies that gives me a a hard time. The paste is wetting too good and climbs the lead of the component and touches the body which is a defect. I just wonder what if there is a way to heat the board e
Electronics Forum | Tue Aug 19 14:41:27 EDT 2003 | D Peter
Good point, I don't know if it will pull moisture from the atmosphere without a dry nitrogen purge. There's another thing to find out. Thank you
Electronics Forum | Mon Feb 26 06:23:38 EST 2001 | johnwatt
Folk's, I've been running with the datapaq system for about 5 years now. I have been using it on both reflow and on wave, the only issue I've ever found is that you cannot predict settings for wave, but then you can't do that on Kic and I don't thin
Electronics Forum | Thu Jul 21 12:15:22 EDT 2005 | fastek
No need to punish yourself Rob.....you are 100% correct on all points.
Electronics Forum | Tue Aug 23 04:04:58 EDT 2005 | Rob
But one of the unique selling points of a Fuji has always been all that space you get to hide things in when the auditors come round.....
Electronics Forum | Mon Aug 14 04:00:25 EDT 2017 | sankarseptember
We check the TDK data sheet reflow profile condition. We check the PCB surface temperature the max temperature is 237.Anyhow We will confirm it by check temperature on TDK point
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