Electronics Forum | Wed Sep 29 06:20:14 EDT 2004 | Peppe
FengAng, I'm involved in similar activities on telecom products and we use as reference: MIL-STD-883E, JESD22, IEC-749. We have 2 climatic chamber to arrange a wide range of test, depending on customer use and/or specs. Based on that experience, we p
Electronics Forum | Mon Feb 13 13:19:35 EST 2006 | pjc
ECD's OvenRIDER is the only instrument I know that can measure thermal transfer efficiency of a an oven. I suppose it would work for environmental chambers too. This instrument has thermocouples to measure ambient temp of oven zones and well as hi-ma
Electronics Forum | Fri Nov 04 11:29:46 EST 2005 | JeffP
Jay, I work for a company that manufactures batch reflow ovens however, I will try to be as subjective as possible. For the most part, what others have posted is true. Yes, there is one heating chamber and if the heater does not have enough power
Electronics Forum | Fri Nov 09 19:31:43 EST 2007 | yshiau
Thank you to Dave and Scott!! What I'm delaing with is mass production test for small memory cards in volume! The reason I choose Non-operating temperature cycling is so that I can deal with volume. I can throw in quite a few memory cards in chambe
Electronics Forum | Tue May 25 18:07:22 EDT 2010 | jlawson
Vacuum Soldering is mostly available with Vapor Phase Soldering systems as a option. Asscon / IBL / Rehm Thermal all offer this... Rehms system is unique as they offer in place solder and vacuum vs the other two vendors that move a PCB with Molten
Electronics Forum | Wed Feb 13 10:39:36 EST 2019 | spitkis2
The QFN will add an insignificant amount of thermal mass since its all in the housing. You just need to make sure the package does not exceed the recommended peak and duration so as not to damage the die internally. Usually the limit is around 250-
Electronics Forum | Mon Dec 30 12:48:18 EST 2019 | rgduval
Keep in mind that the oven temperature does not, necessarily, equate to the board temperature. The thermal characteristics of the parts and copper will cause the board temperature to be different, sometimes significantly, than the oven temperature.
Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon
| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe
Electronics Forum | Mon Jan 08 18:58:27 EST 2007 | Mike F
Normally someone would have replied to tell you to do a search of the archives. I've read at least 4 or 5 different threads dealing with baking out PWB's, but none were for this special material. First, have you contacted the manufacturer of the PW
Electronics Forum | Fri Feb 10 12:09:53 EST 2006 | cyber_wolf
Russ, We use a unit called a Datapaq surveyor to monitor our ovens. Its basically a unit that a data logger rides through the oven in. It has 3 thermal couples across the top and 3 across the bottom. It takes measurements the full width of the proces
