Technical Library | 2006-11-01 22:37:23.0
Flip Chip Plastic Ball Grid Array (FCPBGA) modules, when subjected to extreme environmental stress testing, may often reveal mechanical and electrical failure mechanisms which may not project to the field application environment. One such test can be the Deep Thermal Cycle (DTC) environmental stress which cycles from -55°C to 125°C. This “hammer” test provides the customer with a level of security for robustness, but does not typically represent conditions which a module is likely to experience during normal handling and operation.
Technical Library | 2010-10-21 00:43:34.0
Electronic systems are often stored for long periods prior to deployment in the intended environment. Aging has been previously shown to effect the reliability and constitutive behavior of second-level leadfree interconnects.
New Equipment | Test Equipment
Clover Electronics has extensive test capabilities including, in-circuit, flyinig probe, customer supplied ATE, custom designed models, and thermal cycling. Give us a call and we can meet all of your testing needs.
Technical Library | 2019-04-17 21:29:14.0
Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This paper presents the reliability of land grid array (LGA) component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.
Technical Library | 2012-09-13 20:45:17.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor
Industry Directory | Consultant / Service Provider / Manufacturer / Manufacturer's Representative / Other
Semiconductor and SMT equipments sales new and used. Includes FA lab equipment Test, FIB, SEM, EDX,, C-SAM, inspection and probers
Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
New Equipment | Solder Materials
Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to
Industry Directory | Manufacturer
Pioneers in the area of solderless assembly technology and originators of the OCCAM process. Developing IP for next and future generations of high reliability and better performing electronic products.
