Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Manufacturer
XPCB is a PCB manufacturer with superior expertise in multilayer rigid-flex PCB and flex PCB, supporting special technology including VIPPO, stacked vias, buried vias, blind vias, unsymmetrical structure, and air gap structure.
Affordable Manufacturing Execution System (MES), Shop Floor Automation and Integration Software CELLS WORKFLOW Product Tracking MES is an affordable full Manufacturing Process Control Software System providing Plant Intelligence for any industry.
New Equipment | Fabrication Services
Flexible PCB includes single sided FPC, double sided FPC and multilayer FPC, etc. Single FPC has chemically etched conductive pattern layer, the conductive pattern layer on the surface of the flexible insulating substrate is calendered copper foil. T
Electronics Forum | Fri Jan 04 14:21:35 EST 2008 | ck_the_flip
If all your doing is trying to measure oven repeatability, but then you wanna do it a bunch of times, have a profiling "board" constructed out of say... delmat, delrin, or some other glastic-type pallet material. Have the T/C's permanently fastene
Electronics Forum | Fri Jan 04 09:44:59 EST 2008 | philkaz
Hello, I am Philip Kazmierowicz and I work with KIC, a Thermal Profiling company. We have done many lifetime experiments on Printed Circuit Boards over the years. The key thing to understand is that if the primary material of the board in FR4 fiber
Used SMT Equipment | THT Equipment
Cycle Rate Max 25,000 cph (0.14 sec. per insertion) Reliability 200 ppm or better Component Types Capacitors, resistors, diodes, jumper wire, etc. Component Specs Component Class I Distance Between Tapes 52.4mm +/- 1.5mm (2.063” +/- 0.059”) Pit
Used SMT Equipment | General Purpose Equipment
Year 2008 - Like New Condition Tyco SEP 3T Shuttle Electric Press Standalone electric press for the application of PCBs onto compliant pin housings or connectors • Servo electric press with shuttle system for product location under press ram • Ho
Industry News | 2013-10-10 09:56:45.0
GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Parts & Supplies | SMT Equipment
USE ALTENATIVE PART > u FUJI S5120A SWITCH PHOTO FUJI S5124A SWITCH PHOTO FUJI S5125A SWITCH PHOTO FUJI S5126A SWITCH PHOTO FUJI S5128A SWITCH PHOTO FUJI S5129A SWITCH PHOTO FUJI S5133A SWITCH PHOTO FUJI S5134A SWITCH PHOTO FUJI S51
Parts & Supplies | Pick and Place/Feeders
USE ALTENATIVE PART > u FUJI S5120A SWITCH PHOTO FUJI S5124A SWITCH PHOTO FUJI S5125A SWITCH PHOTO FUJI S5126A SWITCH PHOTO FUJI S5128A SWITCH PHOTO FUJI S5129A SWITCH PHOTO FUJI S5133A SWITCH PHOTO FUJI S5134A SWITCH PHOTO FUJI S5135A SWITCH PHOTO F
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
www.unisoft-cim.com/cells.html - CELLS WORKFLOW is affordable, simple to setup & use yet powerful product & job tracking software for fast New Product Introduction (NPI). The CELLS WORKFLOW software provides total traceability in manufacturing floor
Training Courses | | | IPC Designer Certification CID
The Certified IPC Designer CID (Certified Interconnect Designer) course is the industry's premier professional development program for experienced PCB design professionals.
Events Calendar | Tue Mar 06 00:00:00 EST 2018 - Tue Mar 06 00:00:00 EST 2018 | ,
Electronics in Harsh Environments Conference - Free Pre-Conference Webinar
Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
Career Center | , New York USA | Engineering,Research and Development
DESCRIPTION � Responsible for the development and deployment new printed circuit board assembly processes. � Will assume responsibility for Pb-free/RoHS project management & implementation. � Plans, directs, and coordinates manufacturing processes
Career Center | , Illinois USA | Engineering,Research and Development
DESCRIPTION � Responsible for the development and deployment new printed circuit board assembly processes. � Will assume responsibility for Pb-free/RoHS project management & implementation. � Plans, directs, and coordinates manufacturing processes
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
, continuous monitoring during thermal cycling. Thermal cycling was done in accordance with the IPC-9701A guideline [22]. The solder joints were monitored using an event detector set at a resistance limit of 1000 ohms. The failure data are reported as
| https://www.eptac.com/faqs/ask-helena-leo/ask/reliability-of-reworked-lead-free-assemblies
. How many more rework cycles can we do before compromising the reliablity of the assemblies?” In the past we used to recommend 5 thermal cycles and a removal and replacement was consider one cycle
