Industry Directory | Manufacturer
Heller Thermal Systems India location featuring reflow soldering ovens and pressure curing ovens.
Industry Directory | Consultant / Service Provider / Training Provider
ERI is a specialized engineering school, focusing on the reliability and durability of hardware, upon the kinds of stresses that can shorten the life of hardware such as yours and upon appropriate tests to uncover weaknesses.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
New Equipment | Education/Training
This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components. Students are taught methods for safe and reliable BGA component rework using a top of the
Electronics Forum | Thu Oct 26 03:20:13 EDT 2000 | heccles
What would be a typical thermal test regime to verify the quality of solder joints for high specification applications - what would be the specific benefits of utilizing a "HALT" process over other traditional test techniques ?
Electronics Forum | Thu Oct 26 09:10:30 EDT 2000 | ptvianc
I am not familiar with the "HALT" terminology. Do you mean HAST testing? As for thermal fatigue, the most severe conditions are typically those cited for military and/or satellite applications. There are several temperature ranges that are used to
Used SMT Equipment | Adhesive Dispensers
Screw , nut and bolt coating machine TH-2004l3 Features: Thread locking sealant equipment are a cost effective and superior alternative to lock washers, locking threads, and studs. Prevent loosening due to vibration or thermal expansi
Used SMT Equipment | In-Circuit Testers
FLIR A320 High Resolution, Plug & Play Infrared Camera for Machine Vision The FLIR A320 Infrared Camera is an affordable and accurate solution for machine vision and automation systems that require non-contact imaging and temperature measurement
Industry News | 2015-11-12 22:03:28.0
Heller Industries is thrilled to announce that we've partnered with the #1 Northern California Sales Representative Group - Lean-Stream!
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Parts & Supplies | Assembly Accessories
Advantages of KIC START Cheap price. The temperature curve can be drawn quickly and accurately. Immediate and objective temperature curve analysis Easy to use software Manual temperature curve prediction Reliable and secure hardware 24-Hour cu
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
The Centurion™ is a forced-convection SMT reflow system with tight, closed-loop process control, built for today’s high-throughput PCB assembly environments. With the best heat transfer in the industry, the Centurion is able to run any profile at the
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
Career Center | Lenexa, Kansas USA | Engineering
IM091891 - Senior Electronic/Electrical Design & Development Engineer - Wisconsin Excellent engineering management opportunity with a leading manufacturer of mobile construction equipment. The Senior Design & Development Engineer will lead the dev
Career Center | Syracuse, New York USA | Engineering
Lead the development of next generation industrial high reliability motor drives used in BLDC applications. Keyword must have’s include: Switch Mode Power Supplies, EMI/EMC design compliance, Hardware Design, Customer Solutions for Design Specific
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
SMTnet Express, July 12, 2018, Subscribers: 31,180, Companies: 10,985, Users: 24,934 Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive T. Wada
Heller Industries Inc. | https://hellerindustries.com/bit_publications/the-effect-of-vacuum-reflow-processing-on-solder-joint-voiding-and-thermal-fatigue-reliability/
The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability. - Heller Industries Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5218
The Influence of Printed Circuit Board Thickness on the Thermal Fatigue Reliability of Quad Flat No-Lead Packages 中文 MEMBERS LOGIN Membership Become a Member
