New Equipment | Rework & Repair Equipment
Protecting Heat Sensitive Components. Are you in need of a flexible method for shielding nearby components during the PCB rework process? Do you find yourself looking for an effective heat shielding product which can be easily modified to protect a
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Wave Solder Pallet for PCB Assembly Prior Plastic is one of the most professional manufacturer of wave solder pallets and reflow solder pallets in China. Each one of our pallet is custom designed to meet our client's requirements. Just tell us your
Electronics Forum | Fri Sep 12 08:01:55 EDT 2008 | davef
There is no standard. On the web, you can find shelf life estimates for various types of solderability protection on bare boards. These estimates won't translate directly to the storage of assembled boards, because assembled boards [and the solderabi
Electronics Forum | Sun Aug 08 20:59:55 EDT 1999 | Dreamsniper
| | | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usua
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2019-04-14 18:51:44.0
IPC -- Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit presentation topics and descriptions for IPC Electronics Materials Forum, a new technical conference focusing on developments in materials and processes associated with electronics assembly and manufacturing. The conference will be held in Minneapolis, Minn., November 5-7, 2019.
Technical Library | 2018-05-23 12:12:43.0
Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop.
Overview of PRO 1600 Forced Convection Reflow Oven in operation. Features include small footprint (31" x 31"), lead free reflow capable, and precise software process control.
Overview of PRO 1600 Forced Convection Reflow Oven in operation. Features include small footprint (31" x 31"), lead free reflow capable, and precise software process control.
SMTnet Express, November 4, 2021, Subscribers: 26,512, Companies: 11,460, Users: 26,912 Fabrication Of Solderable Intense Pulsed Light Sintered Hybrid Copper For Flexible Conductive Electrodes Additively printed circuits provide
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/thermal-compounds?con=t&page=39
time than most industrial thermal interface materials. Also be sure to see our range of high quality solder paste formulations. Products Content Your results for
| https://www.smtfactory.com/I-C-T-L24-Professional-PCB-SMT-Reflow-Oven-for-Heat-Sink-soldering-pd42739734.html
I.C.T-L24 | Professional PCB SMT Reflow Oven for Heat Sink soldering from China manufacturer - Dongguan Intercontinental Technology Co.,Ltd. English Türk dili Tiếng Việt 한국어 日本語
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