Industry Directory | Manufacturer
Heller Thermal Systems India location featuring reflow soldering ovens and pressure curing ovens.
Industry Directory | Consultant / Service Provider / Training Provider
ERI is a specialized engineering school, focusing on the reliability and durability of hardware, upon the kinds of stresses that can shorten the life of hardware such as yours and upon appropriate tests to uncover weaknesses.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
New Equipment | Fabrication Services
Flexible PCB includes single sided FPC, double sided FPC and multilayer FPC, etc. Single FPC has chemically etched conductive pattern layer, the conductive pattern layer on the surface of the flexible insulating substrate is calendered copper foil. T
Electronics Forum | Thu Jun 28 09:38:14 EDT 2012 | 14367
PSMN130-200D MOSFET TRANSISTOR D2PAK - failure of some parts led to investigation, oxidization or surface contamination was noticed on remaining parts. The surface contamination could be removed when fingernail was drawn over the bottom terminating s
Electronics Forum | Thu Jun 28 09:38:20 EDT 2012 | 14367
PSMN130-200D MOSFET TRANSISTOR D2PAK - failure of some parts led to investigation, oxidization or surface contamination was noticed on remaining parts. The surface contamination could be removed when fingernail was drawn over the bottom terminating s
Used SMT Equipment | Adhesive Dispensers
Screw , nut and bolt coating machine TH-2004l3 Features: Thread locking sealant equipment are a cost effective and superior alternative to lock washers, locking threads, and studs. Prevent loosening due to vibration or thermal expansi
Used SMT Equipment | In-Circuit Testers
FLIR A320 High Resolution, Plug & Play Infrared Camera for Machine Vision The FLIR A320 Infrared Camera is an affordable and accurate solution for machine vision and automation systems that require non-contact imaging and temperature measurement
Industry News | 2015-11-12 22:03:28.0
Heller Industries is thrilled to announce that we've partnered with the #1 Northern California Sales Representative Group - Lean-Stream!
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Parts & Supplies | Assembly Accessories
Advantages of KIC START Cheap price. The temperature curve can be drawn quickly and accurately. Immediate and objective temperature curve analysis Easy to use software Manual temperature curve prediction Reliable and secure hardware 24-Hour cu
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
The Centurion™ is a forced-convection SMT reflow system with tight, closed-loop process control, built for today’s high-throughput PCB assembly environments. With the best heat transfer in the industry, the Centurion is able to run any profile at the
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | , New York USA | Engineering,Research and Development
DESCRIPTION � Responsible for the development and deployment new printed circuit board assembly processes. � Will assume responsibility for Pb-free/RoHS project management & implementation. � Plans, directs, and coordinates manufacturing processes
Career Center | , Illinois USA | Engineering,Research and Development
DESCRIPTION � Responsible for the development and deployment new printed circuit board assembly processes. � Will assume responsibility for Pb-free/RoHS project management & implementation. � Plans, directs, and coordinates manufacturing processes
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Modelling of Thermal Stresses in Printed Circuit Boards Modelling of Thermal Stresses in Printed Circuit Boards Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal
Heller Industries Inc. | https://hellerindustries.com/bit_publications/the-effect-of-vacuum-reflow-processing-on-solder-joint-voiding-and-thermal-fatigue-reliability/
The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability. - Heller Industries Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5218
The Influence of Printed Circuit Board Thickness on the Thermal Fatigue Reliability of Quad Flat No-Lead Packages 中文 MEMBERS LOGIN Membership Become a Member
