Industry Directory | Consultant / Service Provider / Manufacturer
Providing Belting/Sequencing Tape for Electronics Industry,bandoliering tape 6mm*3000m,thermal melting tape,active and passive component processing,axial taping and radial lead forming for capacitor,LED diode .sales2@chinatape.com
Industry Directory | Distributor / Manufacturer
We are a fabricator / distributor of tapes, labels and gaskets used for high temperature masking (Kapton), conformal coating, emi/rfi shielding, thermal management and high temperature thermal transfer printable labels.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
Electronics Forum | Fri Jan 09 23:53:48 EST 2004 | Dean
How high are we talking? 1000 Celsius? KIC Thermal Profiling double sided aluminum profiling tape. I have used at an extreme application of 240 to 300 degrees celsius for 18 minutes. With up to 30 passes with no visible degree of deterioration.
Electronics Forum | Fri Jan 09 18:28:34 EST 2004 | Ron W
I'd like to know if anyone could recommend a good high-temperature adhesive that can be used for thermocouple attachment. I've always used high-temp solder and tape in the past, but would like to try using adhesive. Any info is certainly appreciated.
Used SMT Equipment | Pick and Place/Feeders
(2) Universal Advantis Pick and Place Systems Universal Advantis Placement System; Product Code: 4982B; AC-72; FlexJet 9 Head; Universal Advantis Placement System; Lightening Head; Product Code: 4983A; With Assorted Nozzles in Nest Auction Ite
Used SMT Equipment | In-Circuit Testers
Takaya APT-9411cj Flying Probe Tester; August 2006 Auction Item: www.xlineassets.com Auction Starts Soon! Other Available Equipment Via Auction: Auction Starts Soon - Complete Factory Closure 4) SMT PRODUCTION LINES INLCUDING: (1) DEK INFI
Industry News | 2016-06-27 14:59:09.0
GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.
Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Parts & Supplies | Tape and Reel
SMT Kapton Tape Polymide film tape Specifications: Antistatic Thermally conductive Polyimides for fine line circuitry Cryogenic insulation Corona resistant Pigmented for color Conformable Other films tailored to meet customers needs Param
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Parts & Supplies | Assembly Accessories
137037 Arcom-8-Channel DEK-CHANNEL-MONIOR-181507 181507 EIDEN Channel TV modulator 121B Furnace temperature teste KIC 2000 profile 9 channel Furnace temperature tester ..KIC 2000 profile 9 channel KIC
Technical Library | 2022-09-29 14:08:42.0
Electronic vehicles, devices and components must not overheat, otherwise they may fail to operate correctly. Thermal management is a major technical challenge as components are getting smaller, power densities are increasing and demands on robustness and reliability are becoming more stringent. To prevent power losses or defects resulting from overheating, liquid thermal interface materials (TIMs) are being increasingly used to dissipate their heat. This White Paper discusses the aspects that need to be taken into account when dispensing these mostly highly viscous, highly abrasive materials and why in many cases they are better alternatives to pads, tapes and foils.
Technical Library | 2020-10-14 14:33:36.0
Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative thermal interface materials like silicones, greases, tapes, or pads. The paper discusses key attributes for designing and formulating advanced thermally conductive epoxies. Comparisons to other common fillers used in packaging are made. The filler size, shape and distribution, as well as concentration in the resin, will determine the adhesive viscosity and rheology. Correlation's between Thermal Resistance calculations and adhesive viscosity are made. Examples are shown that determination of thermal conductivity values in "bulk" form, do not translate into actual package thermal resistance. Four commercially available thermally conductive adhesives were obtained for the study. Adhesives were screened by shear strength measurements, Thermal Cycling ( -55 °C to 125 °C ) Resistance, and damp heat ( 85 °C / 85 %RH ) resistance. The results indicate that low modulus Boron Nitride filled epoxies are superior in formulation and design. Careful selection of stress relief agents, filler morphology, and concentration levels are critical choices the skilled formulator must make. The advantages and limitations of each are discussed and demonstrated.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
http://www.gpd-global.com GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations. The same automated fluid dispensing machine is capable of dispensing fluids and also Pick & Place simple compo
Events Calendar | Wed Apr 19 00:00:00 EDT 2017 - Fri Apr 21 00:00:00 EDT 2017 | Nara, Japan
Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2017)
International Microelectronics Assembly and Packaging Society (IMAPS)
GPD Global | https://www.gpd-global.com/heated-dispensing-thermal-imaging.php
Heated Dispensing Thermal Imaging Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
KingFei SMT Tech | https://www.smtspare-parts.com/sale-11936272-kic-start-thermal-profile-smt-thermal-profilling-image-reflow-profile-9-6-channel-tester.html
KIC START Thermal Profile , SMT Thermal Profilling Reflow Profile 9 6 Channel Tester Leave a Message We will call you back soon
